Printed Circuit Board Design Engineer

Suitable AI; Coimbatore District; On-site; INR 600,000 - 900,000; Full time

Job summary

Suitable AI in India is seeking an experienced PCB Design Engineer with strong expertise in multilayer PCB design, high-speed and high-power layouts, DDR memory routing, and HDI technology. The ideal candidate will have hands-on experience in schematic capture, component library development, PCB placement and routing, and manufacturing output generation using Cadence Allegro.

The candidate will collaborate with cross-functional engineering teams to deliver reliable, manufacturable, and

Qualifications

• Diploma or Bachelor's degree in Electronics and Communication Engineering (ECE/EEE/EIE) required.
• Minimum 4 years of hands-on PCB design and layout experience.
• Proficiency with Cadence Allegro for layout and routing.
• Experience with DDR memory routing and high-speed/high-power designs.
• Experience with HDI design and via structures (blind/buried/microvias).

Responsibilities

• Design multilayer PCBs for high-speed/high-power/mixed-signal applications.
• Place and route PCBs adhering to SI/PI constraints and electrical design rules.
• Develop DDR memory interfaces and high-speed routing techniques.
• Create high-power PCB layouts with thermal management considerations.
• Work on HDI designs including blind, buried, and microvias.
• Plan stack-ups and routing strategies for multilayer designs.
• Perform schematic capture, library development, and layout design.
• Coordinate with hardware, mechanical, SI/PI, and manufacturing teams during reviews.
• Ensure DFM/DFA compliance and generate Gerber, fabrication and assembly drawings.
• Release manufacturing paperwork and coordinate with vendors.

Skills

PCB design

SI/PI awareness

HDI design

DDR routing

Education

Diploma or Bachelor's degree in Electronics and Communications Engineering (ECE/EEE/EIE)

Tools

Cadence Allegro

Job description

Qualification: Diploma / Bachelor’s Degree in ECE, EEE, or EIE

Technical Tool: Cadence Allegro

Job Summary

We are looking for an experienced PCB Design Engineer with strong expertise in multilayer PCB design, high-speed and high-power PCB layouts, DDR memory routing, and HDI technology. The ideal candidate should have hands‑on experience in schematic capture, component library development, PCB placement and routing, and manufacturing output generation using Cadence Allegro.

The candidate will collaborate with cross‑functional engineering teams to deliver reliable, manufacturable, and high‑quality PCB designs that meet electrical, mechanical, and manufacturing requirements.

Key Responsibilities

• Design and develop multilayer PCBs for high‑speed, high‑power, and mixed‑signal applications.
• Perform component placement and PCB routing while adhering to signal integrity (SI), power integrity (PI), and electrical design constraints.
• Design DDR memory interfaces and implement high‑speed routing techniques.
• Develop high‑power PCB layouts with appropriate considerations for current capacity, thermal management, and power distribution.
• Work on High‑Density Interconnect (HDI) PCB designs, including blind vias, buried vias, and microvias.
• Plan PCB stack‑ups and implement appropriate routing strategies for multilayer designs.
• Perform schematic capture, component library development, and PCB layout design.
• Conduct design reviews and resolve layout‑related issues in coordination with hardware, mechanical, SI/PI, and manufacturing teams.
• Ensure compliance with Design for Manufacturability (DFM), Design for Assembly (DFA), and applicable PCB design standards.
• Generate and release manufacturing deliverables, including Gerber files, fabrication drawings, assembly drawings, and other supporting documentation.
• Coordinate with PCB fabrication and assembly vendors to address manufacturing‑related queries and resolve design issues.
• Maintain design documentation, revision control, and release records throughout the development lifecycle.

Required Qualifications and Technical Skills

• Diploma or Bachelor's degree in Electronics and Communication Engineering (ECE), Electrical and Electronics Engineering (EEE), Electronics and Instrumentation Engineering (EIE), or a related discipline.
• Minimum 4 years of hands‑on experience in PCB design and layout engineering.
• Proficiency in Cadence Allegro for PCB layout design and routing.
• Strong experience in the following areas:
• DDR memory PCB layout and high‑speed routing.
• High‑power PCB design and power distribution.
• HDI PCB design involving blind, buried, and microvias.
• Multilayer PCB stack‑up planning and routing techniques.
• Schematic capture and component library development.
• PCB layout design, Gerber generation, and manufacturing release.
• Good understanding of PCB fabrication, assembly processes, and manufacturing constraints.
• Knowledge of DFM, DFA, and PCB layout design best practices.

Preferred Skills

• Understanding of signal integrity (SI) and power integrity (PI) considerations.
• Experience coordinating with PCB fabrication and assembly vendors.
• Ability to interpret mechanical drawings, component placement constraints, and enclosure requirements.
• Familiarity with PCB design documentation, revision management, and engineering change processes.

Soft Skills

• Strong analytical, troubleshooting, and problem‑solving abilities.
• Good communication and interpersonal skills.
• Ability to collaborate effectively with cross‑functional engineering teams.
• Strong attention to detail and commitment to design quality.
• Ability to manage multiple assignments and meet project deadlines.

Ideal Candidate Profile

The ideal candidate will have hands‑on expertise in Cadence Allegro, multilayer PCB layout, DDR routing, high‑power PCB design, and HDI technology. The candidate should be comfortable working across the PCB development lifecycle, from schematic capture and layout design to manufacturing documentation and final design release.