Principal Engineer – RV (EM/IR) Bangalore, Karnataka, India Hardware Engineering Posted 13 hours ago

Qualcomm; Bengaluru; On-site; INR 4,500,000 - 7,500,000; Full time

Job summary

Qualcomm India Private Limited seeks a Principal Engineer – RV (EM/IR) in Bengaluru to lead power integrity and reliability signoff for advanced-node SoC designs. You will drive IR drop and EM analysis and collaborate with cross-functional teams to ensure robust silicon implementation.

The role requires 10+ years in IR/EM analysis, strong scripting, and hands-on tool experience (Cadence Voltus, Ansys RedHawk).

Qualifications

• Bachelor’s degree in Electronics, Electrical Engineering, or related field with 8+ years of hardware experience OR Master’s with 7+ years OR PhD with 6+ years.
• Experience in IR/EM analysis, power integrity, and signoff of SoC designs.
• Hands-on tool experience with Cadence Voltus or Ansys RedHawk.

Responsibilities

• Lead full-chip and block-level IR/EM analysis for advanced-node SoC designs.
• Drive power integrity signoff closure and debug violations.
• Collaborate with Physical Design, Power, Package, and Foundry teams on PDN optimization.
• Define EM/IR methodologies and automation flows; improve signoff strategies.

Skills

IR/EM analysis

Power integrity

Scripting: Tcl, Python, Perl

Signoff ownership

Education

Bachelor’s degree in Electronics / Electrical Engineering / related field

Master’s degree in Electronics / Electrical Engineering / related field

PhD in Electronics / Electrical Engineering / related field

Tools

Cadence Voltus

Ansys RedHawk

Job description

## Principal Engineer – RV (EM/IR)Bangalore, Karnataka, IndiaApply NowFind out how well you match with this jobJob ID3093986## **Company:**Qualcomm India Private Limited## **Job Area:**Engineering Group, Engineering Group > Hardware Engineering**General Summary:**As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.**Minimum Qualifications:**• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 8+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 7+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience.We are looking for an experienced **Principal Engineer –** **RV** **(EM/IR)** to lead power integrity and reliability signoff activities for advanced-node SoC designs. In this role, you will drive IR drop and electromigration (EM) analysis, define signoff methodologies, and collaborate with cross-functional teams to achieve robust and reliable silicon implementation. The ideal candidate should possess deep expertise in power integrity analysis, a strong understanding of advanced-node challenges, and proven experience in leading signoff closure for complex chip designs. **What** **You’ll** **Do*** Lead full-chip and block-level IR drop and electromigration (EM) analysis for advanced-node SoC designs* Drive power integrity signoff closure by identifying, debugging, and resolving IR/EM violations* Collaborate with Physical Design, Power, Package, and Foundry teams to optimize power delivery networks* Define and improve EM/IR methodologies, automation flows, and signoff strategies* Perform static and dynamic IR analysis across multiple operating conditions and scenarios* Analyze power grid robustness, current density, and thermal impacts to ensure design reliability* Support tapeout activities and ensure high-quality signoff delivery within project timelines**What** **We’re** **Looking For*** Bachelor’s or Master’s degree in Electronics, Electrical Engineering, or VLSI-related discipline* 10+ years of experience in IR/EM analysis, power integrity, or Physical Design signoff* Strong understanding of power integrity concepts including static/dynamic IR drop, EM analysis, and power grid optimization* Hands-on experience with industry-standard tools such as Cadence Voltus, Ansys RedHawk, or equivalent* Good understanding of Physical Design flow including floorplanning, placement, CTS, routing, and extraction* Strong scripting skills in Tcl, Python, Perl, or Shell for automation and flow development**Good to Have*** Experience with advanced technology nodes such as 7nm, 5nm, 3nm, or below* Exposure to package-aware analysis, thermal analysis, and low-power methodologies* Experience in leading signoff closure for large-scale SoC or high-performance compute designs**Success in This Role Looks Like*** Achieving robust IR/EM signoff with minimal iterations and successful tapeout execution* Early identification and resolution of power integrity risks impacting performance and reliability* Improved signoff productivity through methodology enhancements and automation initiatives* Strong technical leadership and collaboration across implementation and signoff teams**Location** On-site – Bengaluru**Applicants**: Qualcomm is an equal opportunity employer. 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