Senior Staff Engineer – RV (EM/IR)

Qualcomm; Bengaluru; On-site; INR 3,000,000 - 6,000,000; Full time

Job summary

Qualcomm India Private Limited is seeking a seasoned Hardware Engineer in Bengaluru to plan, design, verify, and test electronic systems across Digital/Analog/RF/optical domains. You will lead IR/EM analysis, drive power integrity signoff, and collaborate with multiple teams to ensure robust, high-performance SoC designs and timely tapeouts.

Candidates should have 8+ years in hardware engineering with deep Power integrity knowledge and hands-on experience with Cadence Voltus and Ansys RedHawk.

Qualifications

• Bachelor's/Master's/PhD with 8+ years/7+ years/6+ years in hardware engineering or related work experience.
• Strong understanding of power integrity concepts including IR drop and EM analysis.
• Hands-on experience with industry-standard HP/SoC signoff tools.

Responsibilities

• Lead full-chip and block-level IR drop and EM analysis for advanced-node SoC designs.
• Drive power integrity signoff closure by identifying and resolving violations.
• Collaborate with Physical Design, Power, Package, and Foundry teams to optimize PDP networks.
• Define and improve EM/IR methodologies and automation flows.
• Support tapeout activities and ensure high-quality signoff delivery.

Skills

IR/EM analysis

Power integrity

Physical Design signoff

Cadence Voltus

Ansys RedHawk

Scripting (Tcl/Python)

Education

Bachelor's degree in Electronics/Electrical Engineering/VLSI

Master's degree in Electronics/Electrical Engineering/Engineering

PhD in Electronics/Electrical Engineering/Engineering

Tools

Cadence Voltus

Ansys RedHawk

Job description

Company:

Qualcomm India Private Limited

Job Area:

Engineering Group, Engineering Group > Hardware Engineering

General Summary:

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.

Minimum Qualifications:

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 8+ years of Hardware Engineering or related work experience.
• Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 7+ years of Hardware Engineering or related work experience.
• PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience.

OR

OR

What You’ll Do

• Lead full-chip and block-level IR drop and electromigration (EM) analysis for advanced-node SoC designs
• Drive power integrity signoff closure by identifying, debugging, and resolving IR/EM violations
• Collaborate with Physical Design, Power, Package, and Foundry teams to optimize power delivery networks
• Define and improve EM/IR methodologies, automation flows, and signoff strategies
• Perform static and dynamic IR analysis across multiple operating conditions and scenarios
• Analyze power grid robustness, current density, and thermal impacts to ensure design reliability
• Support tapeout activities and ensure high-quality signoff delivery within project timelines

What We’re Looking For

• Bachelor’s or Master’s degree in Electronics, Electrical Engineering, or VLSI-related discipline
• 10+ years of experience in IR/EM analysis, power integrity, or Physical Design signoff
• Strong understanding of power integrity concepts including static/dynamic IR drop, EM analysis, and power grid optimization
• Hands-on experience with industry-standard tools such as Cadence Voltus, Ansys RedHawk, or equivalent
• Good understanding of Physical Design flow including floorplanning, placement, CTS, routing, and extraction
• Strong scripting skills in Tcl, Python, Perl, or Shell for automation and flow development

Good to Have

• Experience with advanced technology nodes such as 7nm, 5nm, 3nm, or below
• Exposure to package-aware analysis, thermal analysis, and low-power methodologies
• Experience in leading signoff closure for large-scale SoC or high-performance compute designs

Success in This Role Looks Like

• Achieving robust IR/EM signoff with minimal iterations and successful tapeout execution
• Early identification and resolution of power integrity risks impacting performance and reliability
• Improved signoff productivity through methodology enhancements and automation initiatives
• Strong technical leadership and collaboration across implementation and signoff teams

Location

On-site – Bengaluru

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