MGR II R&D/Product DVL Engineering - SI Simulation

TE Connectivity; Bengaluru; Hybrid; INR 900,000 - 1,500,000; Full time

Job summary

TE Connectivity in Bengaluru seeks a seasoned PCB Simulation Manager to lead a high‑speed PCB simulation team. You will guide SI/PI/EMC/RFI analysis, roadmaps, and cross‑functional collaboration with hardware, mechanical and manufacturing groups to ensure designs meet performance and manufacturability goals.

You will drive innovation in simulation methodologies, manage multiple complex projects, and champion DoE and rigorous validation to deliver first time right prototypes and scalable mass

Qualifications

• 15 years of hands-on experience in high-speed PCB simulation.
• 5-7 years of progressive leadership or management experience.
• Proficient in PCB layout, libraries and schematics, routing, manufacturability.
• Strong knowledge of IPC, PCIe, USB, Ethernet and design for manufacturability.

Responsibilities

• Lead and mentor the simulation team for SI/PI/EMC/RFI and thermal incidents.
• Define simulation strategy, methodologies, and best practices across PCB projects.
• Provide technical direction on SI/PI/EMC/RFI for high-speed interfaces (DDR, PCIe).
• Conduct design reviews and provide optimization recommendations.
• Collaborate with global hardware, mechanical, and manufacturing teams.
• Drive process improvement, DoE, and cross-correlation with experiments.
• Manage multiple PCB simulation projects to meet deadlines and budgets.

Skills

Leadership

Strategic thinking

Team management

Communication

Problem solving

Project prioritization

Education

Bachelor's degree in Electrical/Electronics Engineering

Master's degree preferred

Tools

Ansys SIwave/HFSS

Keysight PathWave ADS

Keysight SIPro

Siemens HyperLyX

Cadence Sigrity

Dassault CST Studio Suite

Ansys EMC Plus

Cadence Microwave Office

Ansys ICEPAK/Siemens FLOTHERM/Cadence CELSIUS

Cadence Allegro

Altium Designer

Siemens PADS

Job description

Job Overview

A Printed Circuit Board (PCB) Simulation Manager is a senior engineering leader in Digital Data Networks (DDN) business in TE Connectivity, responsible for overseeing and guiding a team of engineers who simulate and analyse high speed PCB designs encompassingelectrical and thermal simulations. Their primary role is to ensure that all PCB layouts meet high standards for performance, reliability, and manufacturability before prototyping and mass production at competitive cost.

Responsibilities:

• Team leadership and management: Lead, mentor, and develop simulation team for signal integrity, power integrity, electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents. Manage workload, project allocation, and career growth for team members.
• Simulation strategy and roadmap: Define and implement simulation methodologies and best practices for accuracy, efficiency, optimizations and recommendations across all PCB simulation projects.
• Technical oversight and guidance: Provide technical direction on simulation tasks and result interpretations on signal integrity (SI) for high-speed interfaces like DDR and PCIe, power integrity (PI) for efficient power delivery, electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal management.
• Design review and validation: Conduct design and simulation reviews, providing strategic recommendations to optimize PCB performance and reliability.
• Cross-functional collaboration: Work closely with global hardware, mechanical, and manufacturing teams to translate product requirements into viable PCB designs and simulations. Communicate with cross-functional teams, customers and suppliers on simulation results and design risks.
• Continuous improvement: Drive innovation and improvement in the PCB simulation process. Stay current with emerging technologies, design standards (e.g. IPC), and simulation tools to enhance efficiency and maintain a competitive edge.
• Project and resource management: Independent management of multiple complex PCB simulation projects simultaneously, ensuring projects meet deadlines, budget requirements, and performance targets.
• Quality Management: lead and drive accuracy in simulations, conduct design of experiments (DoE), plausibility check and sensitivity study of simulations, cross-correlation of simulation results with experimental results, and design optimizations for first time right manufacturability (prototypes and mass production).

Candidate Desired Profile:

Education:

• A bachelors degree in electrical or electronics engineering from a premier institute/university. A master's degree in a related field is preferred.

Experience:

• Around 15 years of extensive hands‑on experience in high-speed PCB simulation, with a proven track record of successfully delivering complex projects with deadlines.
• 5-7 years of progressive leadership or management experience.
• Breadth and depth on high performance team building, employee goal setting and performance management, talent hiring and nurturing, capability development, project acquisition, customer discussion, alignment with business objective and goals, QCD (quality, cost and delivery), strategy and execution, employee engagement, empowerment and delegation, competency and knowledge management.
• Proficient and foundational knowledge on printed circuit board layout, libraries and schematics, routing and manufacturability.

Technical Skills:

• Expertise with simulation tools for high-speed electrical and thermal analysis - Ansys SIwave/HFSS, Keysight Pathwave ADS, Keysight SIPro, Siemens HyperLyx, Cadence Sigrity, Dassault CST Studio Suite, Ansys EMC Plus, Cadence Microwave Office, and Ansys ICEPAK/Siemens FLOTHERM/Cadence CELSIUS.
• Deep understanding of high-speed digital design principles, signal integrity (SI), power integrity (PI), electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents.
• Good understanding of PCB design and layout tools such as Cadence Allegro, Altium Designer, or Siemens PADS.
• Strong knowledge of industry standards (IPC, JEDEC, PCIe, USB, Ethernet) and PCB manufacturing processes, including design for manufacturability (DFM).

Soft Skills:

• Proven abilities on inspiring leadership, team management, prioritisation, strategy and execution.
• Experience in organizational development, and talent attraction/management/retention.
• Promote and manage employee wellbeing and work‑life balance.
• Passion for Technology and scientific/engineering excellence.
• Excellent problem‑solving and analytical skills to resolve complex technical issues.
• Strong in Technical Documentations and Report preparation.
• Strong verbal and written communication skills to articulate complex technical concepts to both technical and non‑technical stakeholders.
• Ability to work effectively in a fast‑paced, collaborative global environment and global time zones.
• Proficient using MS office software (Word, Excel, PPT, Outlook, MS Teams, etc.).