Mechanical Simulation Engineer – Advanced Packaging

1840 Micron Tech. OP India LLP; Hyderabad; On-site; INR 900,000 - 1,500,000; Full time

Job summary

Micron Technology, Inc. in Hyderabad is seeking a Mechanical Simulation Engineer to drive thermo-mechanical and multiphysics modeling for advanced semiconductor packaging technologies including HBM, 2.5D, and 3D integration.

You will develop predictive simulation methodologies, integrate AI-assisted tools to optimize workflows, and collaborate with cross‑functional teams across design, fabrication and assembly to influence robust package design and reliability.

Qualifications

• 2-5 years of experience in Mechanical/Materials engineering within semiconductor or advanced packaging domains.
• Experience in AI-driven modeling, automation, or data-driven simulation techniques preferred.

Responsibilities

• Perform linear and non-linear static analysis for package and material behavior
• Conduct fatigue, fracture mechanics, and reliability simulations for advanced packages
• Develop multiphysics models (thermo-mechanical, thermal, structural, fluidic)
• Model interfaces including contact, shear, delamination, and interfacial damage
• Integrate Generative AI, AI Assistant tools, and AI for simulation acceleration and optimization
• Apply AI/ML techniques for surrogate modeling, reduced-order modeling, and design optimization
• Develop and deploy automation workflows for simulation setup, solve, and post-processing
• Leverage data-driven methods to enhance model fidelity and reduce turnaround time
• Support development of HBM, 2.5D/3D packages, TSV, and hybrid bonding technologies
• Understand fabrication and assembly processes such as thermo-compression bonding, reflow, and wafer bonding
• Develop material models for polymers, composites, and thin-film stacks
• Drive material characterization workflows and validation
• Perform failure and reliability analysis including fatigue life and crack propagation
• Collaborate with global cross-functional teams

Job description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Mechanical Simulation Engineer, you will drive thermo-mechanical and multiphysics modeling for advanced semiconductor packaging technologies including HBM, 2.5D, and 3D integration. The role focuses on enabling robust package design through advanced simulation, material characterization, and failure mechanism understanding. You will actively integrate Generative AI, AI Assistant tools, and broader Artificial Intelligence capabilities to optimize modeling workflows, enhance predictive analytics, and automate complex simulations. This includes leveraging AI to improve simulation accuracy, reduce cycle time, and enable advanced modeling capabilities. You will collaborate with cross-functional teams across package architecture, fabrication, and assembly process integration to develop predictive simulation methodologies and influence design decisions.

Job Responsibilities:

• Perform linear and non-linear static analysis for package and material behavior
• Conduct fatigue, fracture mechanics, and reliability simulations for advanced packages
• Develop multiphysics models (thermo-mechanical, thermal, structural, fluidic)
• Model interfaces including contact, shear, delamination, and interfacial damage
• Integrate Generative AI, AI Assistant tools, and Artificial Intelligence for simulation acceleration and optimization
• Apply AI/ML techniques for surrogate modeling, reduced-order modeling, and design optimization
• Develop and deploy automation workflows for simulation setup, solve, and post-processing
• Leverage data-driven methods to enhance model fidelity and reduce turnaround time
• Support development of HBM, 2.5D/3D packages, TSV, and hybrid bonding technologies
• Understand fabrication and assembly processes such as thermo-compression bonding, reflow, and wafer bonding
• Develop material models for polymers, composites, and thin-film stacks
• Drive material characterization workflows and validation
• Perform failure and reliability analysis including fatigue life and crack propagation
• Collaborate with global cross-functional teams

Experience:

2-5 years of experience in Mechanical/Materials engineering within semiconductor or advanced packaging domains, with experience in AI-driven modeling, automation, or data-driven simulation techniques preferred.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron and Crucial brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities - from the data center to the intelligent edge and across the client and mobile user experience.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.