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Micron Technology, Inc is seeking a Senior Engineer specializing in Plasma Modeling to develop predictive digital twins and multiscale models that span process, wafer, die, package, and manufacturing domains. The role focuses on physics-informed AI methods to accelerate technology learning and fab co-optimization.
The ideal candidate holds a Ph.D. in a related field and 5+ years of modeling experience, with strong background in thermodynamics, physics, chemistry, and ML applications in materials
Req. ID:
JR106806 Senior Engineer, Plasma Modeling
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
In the Technology Development — Advanced Modeling & AI Solutions (AMAIS) organization, you will be part of a multidisciplinary team developing next‑generation Digital Twins, predictive modeling solutions, and AI‑driven technologies that accelerate advanced memory development and manufacturing excellence. You will create predictive digital representations of semiconductor processes, materials, structures, equipment, and products across DRAM, NAND, and advanced packaging technologies including HBM. Leveraging physics‑based modeling, computational methods, machine learning, GenAI, large language models (LLMs), and agentic AI frameworks, you will enable technology co‑optimization, design‑space exploration, process optimization, yield improvement, and accelerated technology learning. Working at the intersection of engineering fundamentals, manufacturing data, and digital engineering, you will develop scalable predictive and prescriptive solutions that connect process, structure, performance, yield, reliability, and cost. This role offers the opportunity to influence critical technology decisions, drive fab‑technology co‑optimization, and advance Micron's leadership in data‑driven semiconductor memory innovation.
5+ years of modeling
Ph.D. in Applied Chemistry, Applied Physics, Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or related fields.
Semiconductor Design Engineer 3
(TBD)
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