Mechanical Design Engineer

HCL Technologies Limited; Bengaluru; On-site; INR 2,500,000 - 4,200,000; Full time

Job summary

HCL Technologies Limited in Bengaluru seeks a Mechanical Engineer – Core Design to drive detailed 3D design of mechanical modules and subsystems for semiconductor equipment. You will lead concept creation, selection of materials, and perform FEA for structural and thermal loads while ensuring manufacturability and GD&T compliance.

In this role you will collaborate with electrical, systems, manufacturing, and reliability teams to deliver robust, testable solutions, support prototype builds, and

Qualifications

• 7–10 years of hands-on mechanical design experience in semiconductor equipment or high-tech capital machinery.
• Strong experience in 3D CAD modeling, GD&T, and tolerance analysis.
• Knowledge of DFMA and manufacturability considerations.

Responsibilities

• Core Mechanical Design: create detailed 3D models and assemblies using UG NX and perform trade-off analyses.
• GD&T & Tolerance Engineering: apply ASME Y14.5 standards and stack-ups.
• Sheet Metal & Machined Component Design: design enclosures and brackets with manufacturability in mind.
• Semiconductor Fabrication Process Knowledge: understand vacuum design, plasma interaction, and thermal loads.
• Material Selection & SOM: select materials for vacuum/cleanroom and develop SOM docs.
• FEA – Structural & Thermal: conduct analyses to validate heat dissipation under loads.
• Cross-Functional Collaboration: work with electrical, systems, manufacturing, and reliability teams.
• Testing, Validation & Release: support prototypes, run functional tests, and issue ECOs.

Education

Bachelor’s or Master’s degree in Mechanical Engineering

Tools

UG NX

Teamcenter

Windchill

Job description

The Mechanical Engineer – Core Design plays a key role in the design and development of semiconductor equipment, mechanical modules, sheet-metal structures, precision assemblies, and complex subsystems. The role requires strong expertise in UG NX, GD&T, Sheet Metal, Tolerance Stack-up, Semiconductor Fabrication Processes, Material Selection, SOM, and FEA (Structural & Thermal). This engineer will lead concept creation, detailed design, validation, and cross-functional collaboration to deliver high-quality mechanical solutions.

1. Key Responsibilities

• Core Mechanical Design: Create detailed 3D models and assemblies using UG NX, develop innovative concepts, apply DFM/DFA principles, and conduct trade-off analysis.
• GD&T & Tolerance Engineering: Apply ASME Y14.5 standards, conduct 2D/3D tolerance stack-ups, and validate critical tolerances.
• Sheet Metal & Machined Component Design: Design enclosures, brackets, frames, and apply sheet-metal design rules including bend allowances and manufacturability.
• Semiconductor Fabrication Process Knowledge: Understand vacuum design, plasma interaction, thermal loads, contamination control, and process module interfaces.
• Material Selection & SOM: Select materials based on mechanical, thermal, chemical, and vacuum criteria; develop SOM documentation and risk analysis.
• FEA – Structural & Thermal: Perform structural/thermal analysis, evaluate static/dynamic loads, perform modal studies, and validate heat dissipation.
• Cross-Functional Collaboration: Work with electrical, systems, manufacturing, supply chain, and reliability teams; drive design reviews.
• Testing, Validation & Release: Support prototype builds, perform functional testing, implement ECOs, and release designs through PLM tools.

2. Required Technical Skills

• GD&T (ASME Y14.5)
• Sheet Metal Design and Drafting
• Tolerance Stack-up (Worst Case & Statistical)
• Semiconductor Fabrication Process Knowledge
• Material Selection for Vacuum & Cleanroom Applications
• Structural & Thermal FEA (ANSYS/Abaqus)
• SOM Documentation Knowledge
• DFM/DFA Application
• PLM Tools (Teamcenter/Windchill)

3. Education

Bachelor’s or master’s degree in mechanical engineering or related field.

4. Experience Range

7-10 years of hands-on experience in mechanical design engineering, preferably in semiconductor equipment, high-tech capital machinery, robotics, or precision systems.