Manager, Mod SSD Assembly Equipment

Micron Semiconductor Ltd; Sanand; On-site; INR 1,500,000 - 2,500,000; Full time

Job summary

Micron Semiconductor Ltd in Sanand, Gujarat is hiring a seasoned PCB Assembly Process Engineer to lead continuous improvement, optimize process capability, and ensure reliable equipment performance in a high-volume manufacturing environment.

You will mentor teams, drive AI-driven solutions, uphold CpK > 2.0 targets, manage maintenance programs, and collaborate with suppliers to cut costs while maintaining quality.

Qualifications

• Bachelors degree in Engineering (mechanical, electrical, or electronics).
• Minimum 8 years of PCB assembly engineering experience.
• Strong leadership and adept communication ability.
• Excellent problem solving and analytical abilities.
• Leveraging AI & applying AI in processes.
• High degree of self initiative and ability to think and act independently.
• Ability to work under tight timeframes and prioritize competing activities.

Responsibilities

• Improve key performance indices to benchmark targets.
• Ensure tool performance and availability to capacity model.
• Establish and control processes thru SPC/FD methodology; ensure CpK > 2.0 on cSPL indices.
• Improve product yield for assembly processes.
• Ensure production equipment is in control and product quality meets expectations.
• Implement preventive/predictive maintenance program.
• Establish teams to work on continuous improvement.
• Reduce cost through continuous cost reduction efforts.
• Identify key cost drivers and work on cost reduction programs.
• Implement productivity improvement programs.
• Monitor spare cost and drive down liabilities of spare inventories.
• Define and develop capabilities, strategy and roadmap.
• Maintain a matrix on equipment capabilities and constraints.
• Leverage suppliers to roadmap and benchmark.

Skills

Leadership

Communication

Problem solving

Analytical skills

AI applications

Independence

Time management

Education

Bachelors in Engineering

Job description

Job Responsibilities:

• Improve the key performance indices to BIC
• Ensure tool performance and availability to the capacity model
• Establish and control processes thru SPC/ FD methodology; ensure CpK >2.0 on cSPL indices
• Improve product yield for assembly processes
• Ensure the production equipment is in control and quality/reliability of product meets expectation
• Implement Preventive / Predictive maintenance program
• Establish team(s) to work on continuous improvement
• Establish indirect spare inventory system for key equipment
• Reduce cost through continuous cost reduction effort
• Identify the key cost drivers and work on cost reduction programs
• Implement productivity Improvement programs
• Monitor spare cost and drive down liabilities of spare inventories
• Define and develop capabilities, strategy and roadmap
• Maintain a matrix on equipment capabilities and constraints
• Leverage material and equipment suppliers to roadmap
• Regularly conduct benchmarking exercise
• Develop People to enable Center of Excellence model

Requirements:

• Bachelors degree in Engineering, preferred mechanical, material, electrical & electronics engineering
• Minimum8 years of working experience in PCB assembly engineering industry
• Strong leadership skills and adept communication ability
• Excellent problem solving skills and strong analytical abilities
• Leveraging Artificial Intelligence & Applying Artificial Intelligence
• High degree of self initiative and ability to think and act independently
• Possess ability to work under tight timeframes and prioritize competing activities
• High degree of self-initiative and ability to think and act independently