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Scrgww is seeking an experienced engineer to drive PCBA NPI and SMT process development for high-volume electronics. You will lead process qualification, line startup, and sustainment, coordinating with suppliers and cross‑functional teams to ensure readiness and quality.
Key areas include DFx implementation, DFS testing, and continuous improvement in yield, cycle time, and cost. Onsite development at manufacturing locations is expected, with strong technical communication skills a must.
Support PCBA Design for Manufacturability (DFM/DFx), NPI, and SMT process development for high-volume electronics manufacturing.
Participate in development and NPI builds, supporting PCBA manufacturing readiness, build execution, issue resolution, and process qualification.
Oversee PCBA subcontractors and manufacturing partners to maintain approved process parameters, test procedures, quality standards, and build readiness.
Provide technical guidance on SMT processes including solder paste printing, surface mounting, SPI, AOI, reflow, underfill, thermal gel application, waterproofing, tooling, fixtures, solder deposition, and volume rework.
Develop and improve PCBA manufacturing workflows, including acceptance testing, line startup, process qualification, and sustaining support.
Lead continuous improvement activities focused on lean manufacturing, cycle-time reduction, process yield, failure analysis, root-cause resolution, quality improvement, and cost reduction.
Evaluate and implement cost opportunities through process optimization and yield improvement while maintaining required quality standards.
Support onsite development and sustaining builds and coordinate closely with multidisciplinary engineering, manufacturing, quality, supplier, and operations teams.
Key Requirements
Bachelor’s degree in Mechanical, Chemical, or Industrial Engineering, or equivalent practical experience.
4+ years of hands-on NPI experience in SMT within a manufacturing facility, with strong PCBA process knowledge.
Proficiency in core SMT processes including solder paste printing, surface mounting, SPI, AOI, reflow, underfill, and thermal gel application.
Proven experience developing PCBA manufacturing workflows, including acceptance testing, line startup, process qualification, rework, and underfill.
Demonstrated success delivering measurable improvements in SMT efficiency, process yield, quality, cycle time, and cost reduction.
Strong technical communication skills for collaborating across multidisciplinary teams, including engineering, manufacturing, quality, operations, suppliers, and vendors.
Hands-on experience with process troubleshooting, failure analysis, root-cause resolution, and structured problem-solving in a manufacturing environment.
Ability to support onsite development and sustaining builds at manufacturing locations.
Preferred Experience
Familiarity with Quality Control frameworks including SPC, QC 7 tools, and Six Sigma methodology.
Experience with lean manufacturing and continuous improvement in SMT/PCBA operations.
Experience with tooling, fixtures, solder deposition, waterproofing, and volume rework processes.
Experience supporting multiple development or manufacturing programs and coordinating resource, schedule, and priority tracking.
Strong DFx, process/test development, and cross-functional problem-solving capability.