IC Technology Development - Wire bond Process SME

U3 Infotech Pte Ltd; Pune District; On-site; INR 1,100,000 - 1,500,000; Full time

Job summary

U3 Infotech Pte Ltd in Pune is seeking a Lead of Wire Bonding to oversee and drive wire bonding operations in a semiconductor facility.

You will manage the wire bonders, implement improvements, ensure quality and collaborate with engineering and production teams to meet output goals. Minimum 4+ years in semiconductor manufacturing, degree in Mechanical/Electrical/Electronics, strong leadership and communication.

Qualifications

• Lead wire bonding operations and manage the wire bond team.
• Implement process improvements and ensure quality standards.
• Maintain records of production parameters and quality data.
• Develop and update SOPs for wire bonding processes.
• Collaborate with engineering for improvements and innovations.
• Communicate with stakeholders and enforce quality control.

Responsibilities

• Lead wire bonding operations and manage the wire bond team.
• Implement process improvements and ensure quality standards.
• Maintain records of production parameters and quality data.
• Develop and update SOPs for wire bonding processes.
• Collaborate with engineering for improvements and innovations.
• Communicate with stakeholders and enforce quality control.

Skills

Leadership

Wire bonding operations

Quality standards

Process improvements

Team coaching

Documentation

Data recording

SOP development

Cross-functional collaboration

Education

Bachelor's degree in Mechanical/Electronics/Electrical Engineering

Job description

About the Role:

As the Lead of Wire Bonding, you will be responsible for overseeing and leading the wire bonding operations within a semiconductor manufacturing facility. Your role involves managing the wire bonders, implementing process improvements, ensuring quality standards, and collaborating with other departments to achieve overall production goals.

Key Responsibilities:

• Extensive experience in wire bonding operations within the semiconductor industry, with a proven track record of leadership.
• In-depth knowledge of various wire bonding techniques and equipment.
• Set up and operate wire bonding equipment according to established procedures.
• Lead and manage the wire bond team, providing guidance, coaching, and support.
• Foster a collaborative and high-performance work environment within the wire bonding department.
• Conduct inspections of wire bonds to ensure they meet quality standards and specifications.
• Troubleshoot and resolve issues related to wire bonding processes, collaborating with CFT teams when necessary to enhance efficiency, quality and yield.
• Maintain accurate records of production activities, including process parameters, equipment settings, and quality control data.
• Contribute to the creation and updating of standard operating procedures (SOPs) related to wire bonding processes.
• Collaborate with engineering teams to implement improvements and innovations in wire bonding technology.
• Establish and enforce quality control measures for wire bonding operations.
• Ensure compliance with industry standards and customer specifications.
• Perform routine maintenance on wire bonding equipment to ensure optimal functionality.
• Develop and implement strategic plans for the wire bonding department in alignment with overall organizational goals.
• Identify opportunities for cost savings, productivity enhancements, and technological advancements.
• Collaborate with other department heads, including engineering, production, and quality assurance, to achieve seamless integration of processes.
• Communicate effectively with stakeholders to address challenges and optimize workflows.
• Identify and address skill gaps within the team.
• Ensure accurate documentation of wire bonding processes, equipment settings, and quality control data.
• Communicate effectively with team members to address issues and drive continuous improvement.
• Generate reports on departmental performance and key metrics.

Qualifications :

• Bachelors degree in Mechanical, Electronics or Electrical Engineering.

Desired Experience Level :

• Minimum 4+ years of experience in semiconductor manufacturing industry.

Essential Attributes:

• Strong analytical and problem-solving skills.
• Excellent communication and interpersonal skills.
• Demonstrated ability to lead and motivat5e a diverse team.

Disclaimer: This job posting has been aggregated from external source. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.

Disclaimer: The job location mentioned in this description is based on publicly available information or company headquarters. Role details, content, and availability are subject to change. Applicants are advised to confirm the latest information directly on the company website before applying.