NPI Wire Bond Process SME (Subject Matter Expert)

CG Semi; Sanand; Presencial; INR 1 500 000 - 2 400 000; Tempo integral

Resumo da oferta

CG SEMI Pvt. Ltd. in Sanand, Ahmedabad, Gujarat, seeks an NPI Wire Bond Process SME to own the wire bonding process during New Product Introduction, from customer alignment to recipe development and mass production release.

You will lead process optimization, 4M readiness, PFMEA and Control Plan, while collaborating with customers to close open items before qualification, and drive yield improvement across packages.

Qualificações

• Bachelor’s degree in ECE/EE/ME or Materials Engineering required.
• Extensive wire-bonding experience in Semiconductor Assembly/OSAT.
• Proven track record in NPI, package qualification, and customer technical discussion/closure.

Responsabilidades

• Define, optimize, and validate wire bonding process parameters (temperature, bond force, ultrasonic power, bonding speed, stitch profile).
• Lead characterization and recipe development for gold ball bonding, copper wire bonding, silver wire bonding, wedge bonding, fine pitch, low-k/ultra-low-k die, stacked die bonding, etc.
• Analyze and prevent bond-related defects (NSOP, weak bond, dog-ear, heel crack, cratering, lifted bond, stitch pull issues).
• Own wire bonding activities in NPI builds, from Engineering Lot Qual build Mass Production.
• Execute APQP deliverables (PFMEA, Control Plan, MSA/GR&R, capability study, material qualification).
• Conduct 4M readiness assessment (Machine, Material, Method, Manpower) including tooling, capillary design, and bond finger evaluation.
• Collaborate with customer on technical discussions and resolve open items prior to qualification closure.

Conhecimentos

Wire Bond Tools

ASM Eagle

K&S IConn

K&S Asterion

Powernexx

Capillary Design

Bond Finger Evaluation

Au/Cu/Al wire

SPC/DOE

Minitab/JMP

MS Office

MES (CIM/Smart Factory)

PFMEA

Control Plan

GR&R

Capability Study

Formação académica

Bachelor's degree in ECE, EE, ME, or Materials Engineering

Ferramentas

Wire Bond Machines / Equipment

Capillary tools

Bonding equipment evaluation

Descrição da oferta de emprego

NPI Wire Bond Process SME (Subject Matter Expert)

CG SEMI Pvt. Ltd. | Sanand, Ahmedabad, Gujarat

Experience: 510 Years

TA Code: 10401

Be Part of CG SEMI Journey Innovate. Collaborate. Lead the Future.

At CG SEMI, we are building Indias semiconductor assembly and testing capabilities for the world. We invite experienced semiconductor professionals to join our growing team and contribute to advanced package launches, process excellence, and next-generation semiconductor manufacturing.

Role Summary

The NPI Wire Bond Process SME is responsible for leading end-to-end technical ownership of the wire bonding process during New Product Introduction (NPI) from customer technical alignment, machine readiness (4M), recipe development, qualification build support until mass production release.
The role ensures engineering excellence in wire bond process capability, yield improvement, equipment optimization, and APQP deliverables for new package launches.

Key Responsibilities

Process Ownership Wire Bond

• Define, optimize, and validate wire bonding process parameters (temperature, bond force, ultrasonic power, bonding speed, stitch profile).
• Lead characterization and recipe development for gold ball bonding, copper wire bonding, silver wire bonding, wedge bonding, fine pitch, low-k / ultra-low-k die, stacked die bonding, etc.
• Analyze and prevent bond-related defects (NSOP, weak bond, dog-ear, heel crack, cratering, lifted bond, stitch pull issues).
• Own wire bonding activities in NPI builds, from Engineering Lot Qual build Mass Production.
• Execute APQP deliverables (PFMEA, Control Plan, MSA/GR&R, capability study, material qualification).
• Conduct 4M readiness assessment (Machine, Material, Method, Manpower) including tooling, capillary design, and bond finger evaluation.
• Collaborate with customer on technical discussions and resolve open items prior to qualification closure.

Wire Bond Machine / Material Management

• Lead machine evaluation, capillary selection, and consumable optimization.
• Perform FAT / SAT / CIQ for wire bond equipment.
• Drive cost reduction initiatives on wire material (Au/Cu/Ag), capillary life, and bonding cycle time (UPH).

Yield & Quality Improvement

• Lead root cause analysis (8D, DMAIC) on wire bond-related issues.
• Improve yield, reduce NSOP rate, lifted bonds, and unit fallout.
• Implement SPC / Process control strategies and ensure process stability.

Technical Skills Requirements

Category

Requirement

• Wire Bond Tools
• ASM Eagle / K&S IConn / K&S Asterion, Powernexx, RapidPro / H&K or K&S wedge bonder
• Materials
• Au/Cu/Al wire, capillary selection, leadframe/substrate design interface
• Analysis
• Ball shear test, Pull test, Cross-sectioning, SEM failure analysis
• Software
• SPC, DOE, Minitab/JMP, MS Office, MES (CIM/Smart Factory)
• Methodology
• APQP, PFMEA, Control Plan, GR&R, Capability Study

Qualifications

• Bachelors degree in ECE, EE, ME, Materials Engineering, or equivalent.
• Minimum 510 years of Wire Bond engineering experience in Semiconductor Assembly / OSAT.
• Proven track record in NPI, package qualification, and customer technical discussion/closure.

Soft Skills

• Strong leadership, mentoring, and cross-functional coordination.
• Excellent communication and presentation skills (internal/external stakeholders).
• Ability to influence without authority in a fast-paced NPI environment.

Make in India, for the World.