Electrical CM Support Engineer - Operations Engineering Team

Nokia; Bengaluru; On-site; INR 1,200,000 - 2,400,000; Full time

Job summary

Nokia in Bengaluru is seeking an Electrical CM Support Engineer to develop, qualify, and sustain advanced assembly and interconnect processes for high-performance electronics. You’ll influence the product lifecycle from NPI to volume manufacturing, driving yield, process optimization, and root-cause analysis.

The role covers SMT, fine-pitch PCBA, laser soldering, flip-chip, underfill, and advanced packaging.

Qualifications

• BS/MS/PhD in Electrical, Electronics, Manufacturing Engineering, or related field.
• Strong expertise in electronics manufacturing, SMT assembly, reflow soldering, thermal profiling, and advanced PCB technologies.
• Hands-on experience with advanced interconnect and packaging technologies (laser soldering, flip-chip, underfill, die attach).
• Proven capability in X-ray inspection, cross-section analysis, solder joint characterization, and failure/root-cause investigations.
• Experience with semiconductor packaging, silicon photonics, RF/optical modules, advanced failure analysis techniques (e.g., SEM, EDS, FIB), and familiarity with Industry 4.0/automation.

Responsibilities

• Develop, qualify, and sustain SMT, through-hole, laser soldering, hot bar soldering, flip-chip, underfill, die attach, and advanced packaging processes.
• Define and maintain robust process windows for reflow soldering and advanced electronic assembly technologies.
• Support New Product Introduction (NPI) from prototype builds through high-volume manufacturing.
• Conduct process characterization, Design of Experiments (DOE), and process capability studies.
• Lead failure analysis and root-cause investigations using X-ray, cross-sectioning, microscopy, and electrical characterization.
• Perform cross-sectional analysis to assess solder joint integrity, PCB structures, and manufacturing defects.
• Drive yield improvement, quality enhancement, process optimization, and cost reduction initiatives.
• Collaborate with design teams to ensure Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Reliability (DFR).
• Develop manufacturing specifications, work instructions, control plans, process documentation, and qualification reports.
• Work closely with suppliers, contract manufacturers, and factory teams for reliability testing and production readiness.

Skills

SMT assembly

Reflow soldering

Thermal profiling

Advanced packaging

Failure analysis

DFM/ DFA/ DFR collaboration

Yield improvement

Root cause analysis

Education

BS in Electrical Engineering

MS/PhD in Electrical,Eelectronics, Manufacturing Engineering

Tools

X-ray analysis

Cross-sectioning

Microscopy

SEM

EDS

FIB

Job description

Join our Engineering Operations Team as an Electrical CM Support Engineer, where you will be responsible for developing, qualifying, and sustaining advanced assembly and interconnect processes used in high-performance electronic products. You will work across the entire product lifecycle, from New Product Introduction (NPI) through volume manufacturing, driving process optimization, yield improvement, and root cause analysis.

In this role, you will support complex assembly technologies including SMT, fine-pitch PCBA, organic and mSAP-based substrates, reflow soldering, hot bar soldering, laser soldering, flip-chip assembly, and advanced packaging solutions. You will leverage inspection and analytical techniques such as X-ray analysis, cross-sectioning, microscopy, and reliability testing to ensure robust manufacturing processes and superior product quality. Our collaborative environment encourages innovation, technical leadership, and continuous improvement while solving challenging manufacturing problems.

NI Lightpath

HOW YOU WILL CONTRIBUTE AND WHAT YOU WILL LEARN

• Develop, optimize, and qualify SMT, through-hole, laser soldering, hot bar soldering, flip-chip, underfill, die attach, and advanced packaging processes.
• Define and maintain robust process windows for reflow soldering and advanced electronic assembly technologies.
• Support New Product Introduction (NPI) from prototype builds through high-volume manufacturing.
• Conduct process characterization, Design of Experiments (DOE), and process capability studies.
• Lead failure analysis and root-cause investigations using X-ray, cross-sectioning, microscopy, and electrical characterization.
• Perform cross-sectional analysis to assess solder joint integrity, PCB structures, and manufacturing defects.
• Drive yield improvement, quality enhancement, process optimization, and cost reduction initiatives.
• Collaborate with design teams to ensure Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Reliability (DFR).
• Develop manufacturing specifications, work instructions, control plans, process documentation, and qualification reports.
• Work closely with suppliers, contract manufacturers, and factory teams for reliability testing and production readiness.

Qualifications

• BS/MS/PhD in Electrical, Electronics, Manufacturing Engineering, Materials Science, or related field
• Strong expertise in electronics manufacturing, SMT assembly, reflow soldering, thermal profiling, and advanced PCB technologies.
• Hands-on experience with advanced interconnect and packaging technologies (laser soldering, flip-chip, underfill, die attach).
• Proven capability in X-ray inspection, cross-section analysis, solder joint characterization, and failure/root-cause investigations.
• Experience with semiconductor packaging, silicon photonics, RF/optical modules, advanced failure analysis techniques (e.g., SEM, EDS, FIB), and familiarity with Industry 4.0/automation.