IC Packaging and RF Simulation - Internship

Axiro Semiconductor; Bengaluru; On-site; INR 201,000 - 279,000; Full time

Job summary

Axiro Semiconductor in Bengaluru invites a diligent IC Packaging and RF Simulation Intern to join our design and engineering teams. You will support EM/RF/SI analyses, help develop models, and assist in correlating simulations with lab data across packaging and high-speed interconnects.

You will collaborate with Packaging, SI/PI, RF engineering, and manufacturing groups to contribute to next-generation semiconductor products, gaining hands-on experience in HFSS, CST, ADS, and SIwave while

Qualifications

• Pursuing or recently completed BE/BTech/ME/MTech in Electronics & Communications, Electrical, RF & Microwave Engineering, Semiconductor Technology, or related fields.
• Basic understanding of Electromagnetic Theory, RF & Microwave fundamentals, Transmission Lines, SI/PI, and packaging concepts.

Responsibilities

• Perform EM, RF, and SI simulations for IC packages and high-speed interconnects.
• Develop and validate models using HFSS, CST, ADS, and SIwave.
• Analyze S-parameters, insertion loss, return loss, impedance discontinuities, crosstalk, and resonance.
• Assist in package electrical model generation and validation.
• Prepare technical reports and engineering documentation.
• Collaborate with Packaging, Design, Validation, and Manufacturing teams.

Skills

RF engineering fundamentals

Electromagnetic theory

Signal integrity

Power integrity

Semiconductor packaging concepts

Python/MATLAB scripting

Education

BE/BTech or ME/MTech in Electronics & Communication / related fields

Tools

Ansys HFSS

CST Studio Suite

Keysight ADS

Ansys SIwave

Cadence AWR

Job description

Axiro Semiconductor is a fabless semiconductor design company headquartered in Bengaluru, driving innovation in RF, wireless infrastructure, satellite communication (Satcom), and high-speed connectivity solutions. Backed by CG Power & Industrial Solutions Ltd. part of the 120-year-old Murugappa Group. Axiro represents India’s leap into the global semiconductor arena. With millions of chips already powering global networks, a world-class team across India, the US, and Europe, and cutting-edge expertise spanning RF, mmWave, GaN, and next-generation communication technologies, Axiro is engineering the future of how the world connects, computes, and communicates.

Role Overview:

The IC Packaging and RF Simulation Intern will support the design, modeling, and optimization of advanced semiconductor packages and RF interconnect structures. The intern will work closely with Package Design, Signal Integrity (SI), Power Integrity (PI), and RF Engineering teams to analyze electrical performance, perform electromagnetic simulations, and contribute to the development of next-generation semiconductor products.

Key Responsibilities:

• Perform electromagnetic (EM), RF, and signal integrity simulations for IC packages, substrates, and high-speed interconnects.
• Develop and validate simulation models using tools such as Ansys HFSS, CST Studio Suite, ADS, and SIwave.
• Analyze S-parameters, insertion loss, return loss, impedance discontinuities, crosstalk, and resonance effects.
• Support package design optimization to meet electrical and RF performance requirements.
• Correlate simulation results with laboratory measurements and characterization data.
• Assist in package electrical model generation and validation.
• Prepare technical reports, presentations, and engineering documentation.
• Collaborate with Packaging, Design, Validation, and Manufacturing teams.

Required Qualifications:

• Pursuing or recently completed a B.E./B.Tech/M.E./M.Tech in Electronics & Communication, Electrical, Communication, RF & Microwave Engineering, Semiconductor Technology, or related fields.
• Basic understanding of Electromagnetic Theory, RF & Microwave Fundamentals, Transmission Lines, Signal Integrity (SI), Power Integrity (PI), and Semiconductor Packaging Concepts.

Preferred Skills:

• Familiar with Ansys HFSS, CST Microwave Studio, Keysight ADS, Ansys SIwave, or Cadence AWR.
• Exposure Wire Bond, Flip-Chip BGA, FC-CSP, WLCSP, or 2.5D/3D packaging.
• Programming or scripting knowledge in Python, MATLAB, or VBA.
• Understanding package substrates, PCB design, and high-speed interfaces.
• Hands-on experience with semiconductor package design and RF simulation.
• Exposure advanced package technologies and high-speed interconnect design.
• Experience correlating simulation and measurement data.
• Mentorship from experienced Package, SI/PI, and RF engineers.

Desired Attributes:

• Strong analytical and problem-solving skills.
• Effective communication and presentation abilities.
• Ability to work in a collaborative engineering environment.
• Passion for RF engineering, semiconductor packaging, and simulation technologies.