Senior IC Packaging Engineer

MosChip; Hyderabad; On-site; INR 2,600,000 - 4,200,000; Full time

Job summary

MosChip is seeking an experienced Senior IC Packaging Engineer to lead architecture, design, and development of advanced IC packaging, MCM, and SiP solutions in Hyderabad. You will drive technology strategy for FCBGA, 2.5D/RDL Fan-Out, and chiplet architectures, coordinating with design teams, foundries and OSATs from feasibility to volume production.

The role requires hands-on packaging expertise, deep domain knowledge in high-speed interfaces (PCIe, CXL, UCIe, LPDDR5X, HBM) and reliability

Qualifications

• Bachelor/Master in Electrical, Electronics or Semiconductor field.
• 8–10+ years in semiconductor package design for SoCs/ASICs/FPGA/AI accelerators.
• Hands-on expertise in FCBGA, SiP, MCM packaging and chiplet architectures.

Responsibilities

• Lead architecture definition and execution of advanced IC, MCM, SiP packaging solutions.
• Own package technology selection, roadmaps, and architecture decisions.
• Drive packaging initiatives including FCBGA, 2.5D, RDL Fan-Out, silicon interposers and chiplet architectures.
• Define substrate stack-ups, RDL architectures, power delivery, high-speed routing, and SI/PI analysis.
• Lead package-level electrical/thermal/mechanical/reliability assessments.
• Develop DFM/DFT/DFR and yield optimization strategies.
• Collaborate with foundries, OSATs, and EDA vendors for qualification and manufacturing readiness.
• Mentor junior engineers and participate in pre-sales discussions and proposals.

Skills

FCBGA packaging

SiP & MCM

UCIe ecosystems

High-speed routing

Cadence Allegro APD

Python scripting

Pre-sales support

Thermal & reliability analysis

DFM/DFT knowledge

Education

B.E./M.Tech in Electrical/Electronics/Semiconductor Technology

Tools

HFSS

SIwave

Ansys Designer

Clarity

Icepak

Job description

Company Overview

MosChip is a semiconductor and embedded system design company with a focus on Embedded, Turnkey ASICs, Mixed Signal IP, Semiconductor & Product Engineering and IoT solutions catering to Aerospace & Defense, Consumer Electronics, Automotive, Medical and Networking & Telecommunications.

About the Role

MosChip is seeking a experienced Senior IC Packaging Engineer to provide technical leadership in the coordination for architecture, design, and development of advanced IC Packaging, Multi-Chip Module (MCM), and System-in-Package (SiP) solutions. This role is ideal for a hands-on packaging expert with deep domain knowledge in advanced semiconductor packaging technologies, chiplet integration, high-speed interfaces, and heterogeneous system design.

The successful candidate will drive package architecture and technology strategy across next-generation packaging platforms including FCBGA, 2.5D/RDL Fan-Out, Silicon Interposers, Chiplet-Based Architectures, and Heterogeneous Integration. The role requires close collaboration with design teams, foundries, OSATs, substrate vendors, and customers from feasibility assessment through volume production.

Key Responsibilities

• Lead the architecture definition, and execution of advanced IC, MCM, and SiP packaging solutions for high-performance and high-density semiconductor products, based on cross functional coordination.
• Own package technology selection, roadmap development, and architecture decisions to meet performance, power, cost, schedule, and scalability objectives.
• Drive advanced packaging initiatives involving FCBGA, 2.5D packaging, RDL Fan-Out, Silicon Interposers, Embedded Die, and UCIe-based Chiplet Architectures.
• Perform and guide package design, floor planning, and physical layout for high-speed interfaces including PCIe, CXL, UCIe, LPDDR5X, HBM, Ethernet, and multi-gigabit SerDes.
• Define substrate stack-ups, bumping strategies, RDL architectures, power delivery networks, high-speed routing methodologies, and signal integrity best practices.
• Lead package-level electrical, thermal, mechanical, and reliability analysis to achieve robust product performance and manufacturability.
• Develop and implement Design-for-Manufacturing (DFM), Design-for-Test (DFT), Design-for-Reliability (DFR), and yield optimization strategies.
• Collaborate with foundries, OSATs, substrate suppliers, assembly partners, and EDA vendors to drive technology qualification and manufacturing readiness.
• Conduct package feasibility studies, technology evaluations, risk assessments, and cost-performance trade-off analyses.
• Establish scalable packaging methodologies, design guidelines, and reusable flows across multiple projects and product families.
• Mentor junior engineers and contribute to the growth of packaging capabilities within the organization.
• Provide technical leadership in customer discussions, proposals, and pre-sales engagements related to advanced packaging solutions.

Required Qualifications

• B.E./M.Tech in Electrical Engineering, Electronics Engineering, Semiconductor Technology, or related field.
• 8-10+ years of industry experience in semiconductor package design and development for SoCs, ASICs, FPGA, AI/ML, Networking, HPC, Storage, or Memory products.
• Strong hands-on expertise in:
• Flip-Chip BGA (FCBGA); System-in-Package (SiP); Multi-Chip Modules (MCM)
• Advanced substrates; RDL and Fan-Out Packaging; Silicon Interposers,
• CSP, WLCSP, QFN, LQFP
• Chiplet-based architectures and UCIe ecosystems
• Deep understanding of SI, PI, TI & Mechanical Analysis related DFM concepts to achieve reliable and high yield packages.
• Proven experience in substrate design, escape routing, power distribution, high-speed package design, and package validation.
• Hands-on experience with Cadence Allegro Package Designer (APD) or equivalent advanced package design tools.
• Ability to work independently and drive complex programs from concept through production in a fast-paced environment.

Preferred Qualifications

• Experience with HFSS, SIwave, Ansys Designer, Clarity, Icepak, CST, or equivalent simulation tools.
• Knowledge of advanced interfaces such as UCIe, PCIe Gen5/Gen6, CXL, DDR5/LPDDR5, HBM, Ethernet, and AI accelerator packaging.
• Experience working directly with leading foundries, OSATs, substrate manufacturers, and assembly/test partners.
• Familiarity with advanced packaging roadmaps including 3D IC, Hybrid Bonding, CoWoS, Foveros, InFO, and next-generation heterogeneous integration technologies shall be a plus.
• Scripting and automation skills using Python, Perl, TCL, or Shell scripting.
• Experience supporting customer engagements, solution architecture reviews, and technical pre-sales activities.

Education Requirements: B.E./M. Tech in Electrical, Electronics, Semiconductor Engineering, or related discipline

Experience: 8 to 10 Years

Domain: Advanced Semiconductor Packaging, SiP, MCM, Chiplets, FCBGA, 2.5D/3D Packaging, Heterogeneous Integration

Location: Hyderabad

Shift: General

Work Week: Monday to Friday