We are seeking a highly skilled and motivated Team Lead Hardware with strong technical expertise in high speed board design based on Intel and PowerPC architectures. In this role, you will lead a team in designing, architecting, and delivering high-density, robust hardware platformsfrom initial concept and layout through
signal/power integrity analysis, FPGA integration, bring-up, and production release. The ideal candidate possesses deep hands-on expertise in high-speed buses and interfaces, HDI PCB design
methodologies, schematic capture, and signal integrity, alongside strong leadership skills and a structured
execution approach.
System Architecture
- Lead the architecture, schematic design, and layout of complex high-speed boards based on Intel and PowerPC (PPC) processors.
- Design and implement high-speed interfaces, including USB 3.0, 10G Ethernet, SerDes, and DDR2/DDR3/DDR4 memory.
- Define HDI PCB stackups, blind/buried microvia rules, routing topologies, and high-speed design constraints.
- Drive Signal Integrity (SI) and Power Integrity (PI) design, including impedance control, differential routing, length matching, crosstalk mitigation, and PDN design.
- Good to have knowledge on FPGA/HDL logic using VHDL and/or Verilog for interface control, logic integration, and board-management functions.
- Lead comprehensive schematic and PCB layout reviews.
Execution, Testing & Process Adherence
- Oversee board bring-up, hardware testing, debugging, and system integration using high-bandwidth oscilloscopes, logic analyzers, and other test equipment.
- Follow established operating procedures, documentation practices, and quality standards.
- Apply Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Test (DFT) practices with manufacturing partners.
- Independently resolve complex technical issues while collaborating effectively with cross-functional teams.
Must-Have Requirements
- Architecture Experience: Hands-on experience designing high-speed boards based on Intel and/or PowerPC (PPC) processor architectures.
- Interfaces & Protocols: Strong expertise in USB 3.0, 10G Ethernet, SerDes, and DDR2/DDR3/DDR4 interfaces.
- EDA Tools & Design: Proficiency in OrCAD schematic capture and strong knowledge of high-speed, multilayer HDI PCB design and layout techniques.
- FPGA Development: Solid VHDL and/or Verilog design and programming skills.
- Signal & Power Integrity: In-depth knowledge of SI/PI principles, transmission-line theory, impedance matching, power-distribution networks, and noise/EMI reduction.
- Language Communication: Strong technical English reading and writing skills.
- Work Ethic & Execution: Ability to work independently and collaboratively within formal processes and procedures, with enthusiasm for learning new technologies.
- Key Advantages / Preferred Experience
- Military & Defence Electronics: Experience designing ruggedized military or aerospace electronics in accordance with defence standards.
- Standard Form Factors: Experience with VPX, VME, cPCI (CompactPCI), PMC, and XMC boards and backplane architectures.
- Advanced EDA Suite: High proficiency with the Cadence OrCAD/Allegro toolchain for schematic capture and PCB layout.