We are looking for an experienced Senior PCB Design Engineer with a strong background in high-density, high-speed digital, FPGA and RF PCB design. The ideal candidate will take ownership of complex PCB layouts, working closely with hardware engineering and manufacturing teams from design through prototype validation.
Key Responsibilities
- Design and develop complex, high-density, multi-layer and HDI PCBs for FPGA/SoC-based embedded systems and RF electronics.
- Implement high-speed digital layouts involving DDR/LPDDR, PCIe, Ethernet, USB, LVDS and SerDes interfaces.
- Develop PCB stack-ups, controlled-impedance routing, differential pair constraints and fine-pitch BGA fan-out strategies.
- Apply signal integrity, power integrity, grounding, shielding, EMI/EMC and thermal design best practices.
- Collaborate with hardware and RF engineers on schematic reviews, component placement, layout constraints and design trade-offs.
- Own PCB design reviews, DFM/DFA/DFT checks, fabrication deliverables and manufacturing release.
- Work with PCB fabrication and assembly partners to resolve manufacturing issues and support board bring-up and validation.
Minimum Qualifications
- Bachelor's degree in Electrical, Electronics or a related engineering discipline.
- 6+ years of professional experience in complex multi-layer PCB design and layout.
- Strong proficiency in Altium Designer or Cadence Allegro.
- Demonstrated experience with high-speed digital design, HDI technology and fine-pitch BGA routing.
- Solid understanding of PCB fabrication, assembly processes and manufacturing constraints.
- Proven experience delivering PCB designs through fabrication, assembly and hardware validation.
Preferred Qualifications
- Experience designing boards incorporating AMD/Xilinx, Intel or other FPGA/SoC platforms.
- Experience with RF PCB layouts, impedance matching, transmission lines and RF/digital isolation.
- Familiarity with SI/PI analysis, power distribution networks and high-speed design verification.
- Experience with rigid-flex PCBs, blind/buried vias and advanced PCB stack-ups.
- Experience developing electronics for aerospace, defence, industrial or other high-reliability applications.
- Ability to independently resolve complex layout challenges and collaborate across engineering disciplines.