Plant Head – EMS (SMT, THT & Box Build) & SMT Operations

Chipmates Technologies; Chennai District; On-site; INR 3,000,000 - 5,500,000; Full time

Job summary

Chipmates Technologies in Chennai is seeking a Plant Head to lead our high-volume semiconductor assembly and PCBA facility. You will drive strategic and operational excellence across SMT lines, ensure world-class quality, and align production with national growth targets.

The role emphasizes PLI and SPECS compliance, local sourcing optimization, Lean/Six Sigma practices, and building a resilient, inclusive culture.

Qualifications

• Bachelor's degree in Electronics/Mechanical/Electrical engineering.
• MBA in Operations or SCM is mandatory.
• 15+ years in EMS/semiconductor industries, with at least 5 years in a Plant Head or senior ops role.

Responsibilities

• Lead end-to-end production operations for high-speed SMT lines.
• Own P&L and drive cost optimization, CAPEX for new SMT lines.
• Scale capacity to meet national semiconductor growth and ensure PLI compliance.
• Optimize local sourcing to strengthen the China+1 supply chain and localization.

Skills

Strategic leadership

P&L management

Lean manufacturing

Six Sigma

Industry 4.0 / IoT

OEE optimization

Education

B.E./B.Tech in Electronics/Mechanical/Electrical Engineering

MBA in Operations or Supply Chain

Job description

Company Overview

Chipmates Technologies delivers world-class electronic manufacturing services with cutting-edge technology, global certifications, and domain expertise. We serve leading OEMs across automotive, medical, aerospace, and consumer electronics sectors.

Role Overview

As thePlant Head, you will serve as the strategic and operational leader of our high-volume semiconductor assembly and Printed Circuit Board Assembly (PCBA) facility. This role is pivotal in driving India’s electronics manufacturing revolution, balancing the high-speed, cost-efficient execution, the high-mix, high-value precision required, and the Industry 4.0-driven automation, and inclusive culture of Semiconductor industries. You will be responsible for scaling operations to meetProduction Linked Incentive (PLI)targets while maintaining world-class quality standards.

Core Responsibilities

• Operational Excellence & SMT Oversight:Lead end-to-end production operations, with a primary focus on high-speed Surface Mount Technology (SMT) lines, including solder paste printing, high-speed component placement, reflow soldering, and AOI/SPI integration.
• P&L Management:Exercise full accountability for the facility’s Profit & Loss (P&L), optimizing unit costs, managing CAPEX for new SMT lines, and driving overall financial sustainability.
• Capacity Scaling & PLI Compliance:Strategically expand manufacturing capacity to align with national semiconductor growth targets and ensure strict compliance withPLI (Production Linked Incentive)andSPECSscheme requirements.
• Supply Chain & Localization:Optimize local sourcing strategies to reduce dependencies and improve the “China+1” supply chain resilience.

Technical Expertise & Quality Management

• Global Quality Standards:Ensure the facility meets and exceeds stringent international standards, includingISO 9001(Quality),IATF 16949(Automotive), andISO 13485(Medical).
• Yield Rate Optimization:Implement advanced process controls to maximizeYield Rates(the percentage of functional assemblies), significantly reducing scrap and rework costs.
• Advanced Inspection:Oversee the integration of 3D Automated Optical Inspection (AOI), Solder Paste Inspection (SPI), and X-Ray technologies to ensure zero-defect outgoing quality.
• Semiconductor Precision:Manage the complexities of semiconductor assembly, ensuring ESD-safe environments and precision handling of micro-components.

Strategic Leadership & People Culture

• Greenfield & Expansion Projects:Lead the setup of ‘Greenfield’ campuses, from facility layout design to the installation of automated material handling systems.
• Industry 4.0 & Digitalization:Drive the adoption of smart manufacturing, utilizing IoT and real-time data analytics to monitor Overall Equipment Effectiveness (OEE).
• Lean Manufacturing:Conduct regular Lean Manufacturing and Six Sigma workshops to foster a culture of continuous improvement and waste reduction.
• Talent Pipeline:Build a robust leadership and technical pipeline by mentoringGraduate Engineer Trainees (GET)and developing specialized training programs for SMT technicians.
• Diversity & Inclusion:Champion a diversified workforce, emphasizing the empowerment of women in precision electronics assembly.

Required Qualifications

• Education:B.E./B.Tech inElectronics,Mechanical, orElectrical Engineering.
• Higher Education:MBA in Operationsor Supply Chain Management from a reputable institute is mandatory.
• Experience:Minimum 15+ yearsof experience in the electronics manufacturing (EMS) or semiconductor industry, with at least 5 years in a Plant Head or Senior Operations leadership role.
• Industry Background:Proven track record in high-speed SMT environments serving the automotive, medical, or aerospace/defense sectors.

Key Performance Indicators (KPIs)

• OEE (Overall Equipment Effectiveness):Target >85% for SMT lines.
• First Pass Yield (FPY):>99.5% on critical assemblies.
• PPM (Parts Per Million):Reduction of customer-reported defects to <50 PPM.
• PLI Target Achievement:100% adherence to quarterly and annual production thresholds.