Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
Responsibilities
- Establish new product package reliability requirements and process standardization to ensure board level reliability emulating customer PCB design.
- Ensure process control during package reliability and establish procedures for the operation team's execution.
- Identify process improvements to achieve cost and productivity gains.
- Coordinate with functional parties to ensure reliability processes comply with industrial standards such as JEDEC and Micron specifications.
- Respond to inquiries from internal and external customers as a subject matter expert for package reliability activities.
- Work with engineering teams to enable new products (NPI) and ensure hardware readiness for package reliability processes such as Temperature Cycling, HAST, HTS, etc.
- Modify and improve reliability processes for existing products.
- Identify, investigate, and document process deviations and troubleshoot them using systematic techniques.
- Perform risk assessments at all decision points within the qualification cycle.
- Develop process reliability methodology, qualification, and engineering evaluation (DOE).
- Identify factors impacting process quality, propose solutions, and evaluate interactions between equipment, processes, and potential issues.
- Implement equipment process control methods and develop process limits and capabilities (CpK); lead process improvement initiatives.
- Align new requirements with industrial standards for reliability process procedures and conduct training or briefing for the operation team.
- Develop process reliability tests for new process failure mechanisms and ensure test methodology follows industry standards such as JEDEC.
- Define process sampling plans and instructions.
- Apply troubleshooting skills using 8D methodology, analyze and report results, and coordinate failure analysis.
- Develop process monitor plans and support excursion material disposition.
Education
- Bachelor’s Degree or equivalent experience in Engineering (Electronics/Electrical, Materials Science, or Mechanical) or a related field of study.
Experience
- Fresh graduates are welcome.
- Familiarity with basic semiconductor processing, device physics, quality, and reliability fundamentals.
- High degree of self‑initiative and ability to think and act independently.
- Good multitasking and problem‑solving skills.
- Ability to work under tight timeframes and prioritize competing activities.
- Excellent organizational and management skills with outstanding interpersonal and teamwork abilities.
- Proven ability to collaborate well with team members and drive for results.
- Strong verbal and written communication skills.
- Ability to collaborate with cross‑functional teams to understand needs and translate them into actionable plans, deliverables, and resource requirements.
- Ability to interact effectively with a wide range of personalities.
- Willingness to travel when required.
EEO Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
Accommodations
To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_india@micron.com.