Sr Engineer - DEMQRA WLR

1840 Micron Tech. OP India LLP; Hyderabad; On-site; INR 800,000 - 1,200,000; Full time

Job summary

1840 Micron Tech. OP India LLP in Hyderabad seeks a Wafer Level Reliability Engineer. In this role, you will conduct essential reliability testing and analysis to support new product qualification and mitigate risks in advanced semiconductor processes.

Candidates should have a Bachelor’s degree with 2+ years of experience in Electrical Engineering or related fields. Strong analytical skills and familiarity with semiconductor reliability concepts are essential.

Qualifications

• Experience in handling Package Level/Wafer Level Reliability Systems.
• Strong background in Semiconductor Reliability Failure Mechanisms.
• Familiarity with statistical concepts relevant to semiconductor reliability.

Responsibilities

• Conduct Wafer Level and Package Level Reliability testing and analysis.
• Perform risk assessment at all decision points in the qualification cycle.
• Ensure that test methodology follows industry standards.

Skills

Reliability Testing

Statistical Analysis

Problem Solving

Data Analysis

Education

Bachelor’s in Electrical Engineering, Microelectronics, or related field

Tools

Parametric Analyzers

Job description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Wafer Level Reliability Engineer at Micron Technology, Inc., you will be responsible for process reliability testing and analysis to support New Product Qualification, Periodic Reliability Monitoring, HVM Fab Process Conversion and Excursion mitigation. In this role you will create reliability models to correlate test structure data to product reliability, develop test methodologies to industry standards, and mitigate process reliability risks for advanced CMOS and Interconnect scaling.

Responsibilities

• Wafer Level and Package Level Reliability testing and analysis for CMOS and Interconnects.
• Comprehend failure modes and failure rate within the scope of the product qualification.
• Perform risk assessment at all decision points within the qualification cycle.
• Provide WLR support for HVM Fab Process conversion and Excursion material disposition.
• Collaborate with Technology Development for new technology node deployment.
• Develop process reliability tests to assess new process failure mechanisms.
• Ensure that test methodology follows industry standards, such as the Joint Electron Devices Engineering Council (JEDEC).

Qualifications

• Experience in handling Package Level / Wafer Level Reliability Systems, Parametric analyzers, or Semiconductor characterization.
• Strong background in Intrinsic Semiconductor Reliability Failure Mechanisms and product fail modes.
• Familiarity with statistical concepts relevant to semiconductor reliability.
• Good understanding of CMOS Device Engineering, process integration and Statistical Quality Control.
• Excellent data analysis and problem solving skills.

Minimum Qualifications

Bachelor’s with 2+ years experience or Master’s in Electrical Engineering, Microelectronics, Nanotechnology or Material Science Engineering.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To learn more, please visit micron.com/careers