Engineer, GQ OPS -REL Process

303A Micron Semiconductor Technology India; Sanada; On-site; INR 1,500,000 - 2,500,000; Full time

Job summary

Micron is seeking a Global Quality Package Reliability Process Engineer to establish reliability requirements for new product packages and standardize processes across product lines. You will manage reliability testing programs, drive process improvements, and ensure board-level reliability that aligns with JEDEC standards.

You will collaborate with design and manufacturing teams to enable NPI, develop DOE-based evaluations, and lead CpK-driven process control initiatives while training

Qualifications

• Bachelor’s degree in Engineering (Electronics, Electrical, Materials Science, Mechanical, or related field).
• Strong knowledge of semiconductor processing, device physics, quality, and reliability fundamentals.
• Excellent analytical and troubleshooting skills; proficiency with systematic techniques such as 8-D.
• Ability to manage multiple priorities under tight timeframes.
• Strong interpersonal, written, and verbal communication skills.
• Demonstrated teamwork and collaboration across cross-functional groups.
• Willingness to travel as required.

Responsibilities

• Collaborate with engineering teams to enable NPI and hardware readiness for package reliability testing.
• Modify and improve reliability processes for existing products.
• Evaluate and improve processes, materials and equipment.
• Identify, investigate, and document process deviations using 8-D.
• Lead process reliability methodology and qualification.
• Develop DOE to identify factors affecting process quality.
• Provide training on updated procedures.
• Support excursion material disposition and apply AI for process improvement.

Skills

Semiconductor processing knowledge

8-D problem solving

Analytical skills

Cross-functional collaboration

Travel willingness

Education

Bachelor’s degree in Engineering (Electronics, Electrical, Materials Science, Mechanical, or related field)

Tools

DOE (Design of Experiments)

CpK analysis

Job description

Global Quality (GQ) Package Reliability Process Engineer

As a Global Quality (GQ) Package Reliability Process Engineer at Micron, you will establish new product package reliability requirements and process standardization, ensuring board level reliability that emulates customer PCB design. You will manage process control during package reliability, develop and improve processes, identify cost and productivity gains, and coordinate with cross-functional teams to maintain compliance with industrial standards such as JEDEC.

Responsibilities

• Work with engineering teams to enable new products (NPI) and ensure hardware readiness for package reliability testing, including Temperature Cycling, HAST, HTS, etc.
• Modify and improve reliability processes for existing products.
• Evaluate and improve processes, materials, and equipment.
• Identify, investigate, and document process deviations, using systematic troubleshooting and 8-D techniques.
• Perform risk assessment at all decision points within the qualification cycle.
• Develop Process Reliability Methodology and lead qualification of process, equipment, and material.
• Establish engineering evaluation (DOE) to identify factors impacting process quality and propose solutions.
• Identify and evaluate interactions between equipment and processes, resolving potential issues.
• Implement equipment process control methods and develop process limits and capabilities (CpK).
• Lead process improvement initiatives to enhance reliability and operational efficiency.
• Introduce new processes and changes to operation, aligning with industry standards.
• Conduct training and briefings for operation teams on updated procedures.
• Develop process reliability tests to assess new process failure mechanisms.
• Define process sampling plans and documentation.
• Support excursion material disposition and apply AI to support process improvement.

Qualifications

• Bachelor’s degree in Engineering (Electronics, Electrical, Materials Science, Mechanical, or related field).
• Strong knowledge of semiconductor processing, device physics, quality, and reliability fundamentals.
• Excellent analytical and troubleshooting skills; proficiency with systematic techniques such as 8-D.
• Ability to manage multiple priorities under tight timeframes.
• Strong interpersonal, written, and verbal communication skills.
• Demonstrated teamwork and collaboration across cross-functional groups.
• Willingness to travel as required.

Equal Employment Opportunity

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. For assistance with the application process or reasonable accommodations, please contact [e-mail].