Director, Physical Design (Custom Silicon Group)

Qualcomm

Bengaluru

Presencial

INR 3 500 000 - 7 000 000

Tempo integral

Há 6 dias
Torna-te num dos primeiros candidatos

Uma candidatura completa num minuto

Currículo e carta de apresentação personalizados, prontos a enviar.

Ultrapassa os filtros ATS

Resumo da oferta

Qualcomm India Private Limited, Bengaluru, is seeking an ASIC Design Manager (Principal/Director Level) to lead the Custom Silicon Group's high-performance SoC development from concept to tapeout. You will drive architecture, RTL design, physical design, verification, bring-up, and production readiness while serving as a key customer-facing engineering leader.

You will guide a team of engineers across geographies, shaping physical design strategy, ensuring convergence, and maintaining signoff

Qualificações

  • Bachelor's or Master's in Electrical/Electronics Engineering, or related field with extensive hardware/VLSI experience.
  • 20+ years of hardware/VLSI engineering experience specializing in physical design and timing signoff for high-speed SoCs.
  • Experience leading multi-site teams and delivering tapeout in advanced nodes.

Responsabilidades

  • Demonstrate proven experience across multiple sites.
  • Lead and manage a team across multiple functions.
  • Design closure and tapeout expertise in advanced technology nodes.
  • Own PnR implementation including Floor planning, Placement, CTS, and post-route activities.
  • Signoff knowledge including STA, Power Analysis, FV, Low Power Verification and PV.
  • Coordinate across design, verification, firmware, software, and validation teams to resolve issues.

Conhecimentos

Floor planning
Placement
CTS
Power analysis
Low Power optimization
Signoff domains
Dfm
Cross-site leadership

Formação académica

Bachelor's in Electrical/Electronics Engineering
Master's in Electrical/Electronics Engineering
PhD in Electrical/Electronics Engineering

Descrição da oferta de emprego

Job Area:

Company:
Qualcomm India Private Limited

Job Area:
Engineering Group, Engineering Group > Hardware Engineering

General Summary:
As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next generation experiences and drives digital transformation to help create a smarter, connected future for all. As an ASIC Design Manager (Principal / Director-Level) in the Custom Silicon Group, you will lead the development and delivery of next-generation, high-performance SoCs from concept to tapeout. You will be responsible for driving the complete silicon development lifecycle, spanning architecture, RTL design, integration, physical design, verification, silicon bring-up, and production readiness. In addition to providing technical and organizational leadership, you will serve as a key customer-facing engineering leader, partnering with strategic customers and stakeholders to translate business requirements into successful silicon solutions.

You will lead a team of engineers and work closely with cross-functional groups across geographies -- including RTL design, verification, CAD, and integration teams. Your role will be pivotal in shaping the physical design strategy, ensuring design convergence, and maintaining signoff integrity across timing, power, and area metrics.

Minimum Qualifications:

  • Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 8+ years of Hardware Engineering or related work experience.

OR
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 7+ years of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience.

Principal Duties And Responsibilities:

  • Demonstrate proven experience in executing responsibilities across multiple sites.
  • Lead and manage a team across multiple functions.
  • Design closure and tapeout expertise in advanced technology nodes.
  • Complete ownership of PnR implementation, including Floor planning, Placement, CTS, and post-route activities on the cutting-edge nodes.
  • Possess mandatory signoff knowledge, including STA, Power Analysis, FV, Low Power Verification and PV.
  • Collaborate effectively to resolve issues related to constraints validation, verification, STA, Physical Design and tapeout
  • Understand deep sub-micron design challenges, including leakage power, signal integrity, and DFM.
  • Support pre-sales and business development activities by evaluating technical feasibility and providing design expertise.
  • Provide technical leadership during design reviews and executive-level customer engagements.
  • Drive resolution of customer-reported issues by coordinating across design, verification, firmware, software, and validation teams.

Minimum Qualifications

  • Bachelor's or Master’s degree in Electrical/Electronics Engineering and 20+ years of Hardware/VLSI Engineering specializing in Physical Design and timing signoff for high-speed SoCs.

Preferred Qualifications:

  • Excellent hands-on experience on Floor planning, PnR and STA flows
  • Good knowledge of Placement/Clock Tree Synthesis (CTS), Low Power/High Performance optimization etc.
  • Thorough understanding of signoff domains- LEC/CLP/PDN etc.
  • 18+ years of experience with Physical Design and timing signoff expertise in latest tech nodes (e.g., 2nm/3nm/4nm/5nm)

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).
Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

If you would like more information about this role, please contact Qualcomm Careers.

Obtém a tua avaliação gratuita e confidencial do currículo.

ou arrasta e larga o ficheiro aqui.

Similar jobs

Ofertas semelhantes que vale a pena comparar

Physical Design , Principal Engineer/Director, (Custom Silicon Group)
Physical Design , Principal Engineer/Director, (Custom Silicon Group)

Qualcomm • Bengaluru

Presencial
INR 4 000 000 - 11 000 000
Director, Physical Design (Custom Silicon Group)
Director, Physical Design (Custom Silicon Group)

QUALCOMM, Inc. • Bengaluru

Presencial
INR 6 000 000 - 12 000 000
Director, Physical Design (Custom Silicon Group) Bangalore, India Hardware Engineering Posted a day ago
Director, Physical Design (Custom Silicon Group) Bangalore, India Hardware Engineering Posted a day ago

QUALCOMM, Inc. • Bengaluru

Presencial
INR 6 000 000 - 11 000 000
Physical Design Engineer, Senior Lead
Physical Design Engineer, Senior Lead

Qualcomm • Hyderabad

Presencial
INR 1 500 000 - 2 100 000
Senior Staff / Principal Engineer – SoC Physical Design
Senior Staff / Principal Engineer – SoC Physical Design

QUALCOMM, Inc. • Bengaluru

Presencial
INR 3 000 000 - 6 000 000
Physical Design Engineer, Lead Engineer Senior
Physical Design Engineer, Lead Engineer Senior

Qualcomm • Hyderabad

Presencial
INR 4 500 000 - 7 500 000
SoC Physical Design Engineer (Senior/Lead)
SoC Physical Design Engineer (Senior/Lead)

Qualcomm • Bengaluru

Presencial
INR 1 800 000 - 3 000 000
Physical Design Engineer, Lead Engineer Senior
Physical Design Engineer, Lead Engineer Senior

QUALCOMM, Inc. • Hyderabad

Presencial
INR 4 000 000 - 7 000 000
Core CPU Physical Design Engineer (Lead/Staff/Sr Staff)
Core CPU Physical Design Engineer (Lead/Staff/Sr Staff)

Qualcomm • Bengaluru

Presencial
INR 3 000 000 - 6 000 000
SoC Physical Design CAD Engineer (Staff/Sr Staff)
SoC Physical Design CAD Engineer (Staff/Sr Staff)

Qualcomm • Bengaluru

Presencial
INR 2 500 000 - 4 000 000