Physical Design , Principal Engineer/Director, (Custom Silicon Group)

Qualcomm; Bengaluru; On-site; INR 4,000,000 - 11,000,000; Full time

Job summary

Qualcomm India Private Limited seeks an ASIC Design Manager (Principal/Director) to lead next‑gen high‑performance SoCs from concept to tapeout, spanning architecture, RTL design, physical design, verification, bring‑up, and production readiness.

You will lead a multi‑site team, coordinate with RTL, CAD, and integration groups, guide design reviews, and drive signoff integrity across timing, power, and area for cutting‑edge nodes in a fast‑moving Custom Silicon group.

Qualifications

• Bachelor's, Master's or PhD in Electrical/Electronics Engineering or related field.
• 17–25 years of Hardware/VLSI Engineering experience with emphasis on Physical Design and timing signoff for high‑speed SoCs.
• Experience across multiple sites, and ownership of PnR, floorplanning and signoff activities.

Responsibilities

• Demonstrate experience across multiple sites and lead a cross‑functional team.
• Provide design closure, tapeout expertise, and ownership of PnR implementation (Floor planning, Placement, CTS, post‑route).
• Lead design reviews and engage with customers at executive levels; drive issue resolution across teams.

Skills

Floor planning

PnR (place and route)

STA flows

CTS

Physical Design

Timing signoff

Signoff domains - LEC/CLP/PDN

Education

Bachelor's degree in Electrical/Electronics Engineering or related field

Master's degree in Electrical/Electronics Engineering or related field

PhD in Electrical/Electronics Engineering or related field

Job description

Company:

Qualcomm India Private Limited

Job Area:

Engineering Group, Engineering Group > Hardware Engineering

General Summary:

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next generation experiences and drives digital transformation to help create a smarter, connected future for all. As an ASIC Design Manager (Principal / Director-Level) in the Custom Silicon Group, you will lead the development and delivery of next-generation, high-performance SoCs from concept to tapeout. You will be responsible for driving the complete silicon development lifecycle, spanning architecture, RTL design, integration, physical design, verification, silicon bring-up, and production readiness. In addition to providing technical and organizational leadership, you will serve as a key customer-facing engineering leader, partnering with strategic customers and stakeholders to translate business requirements into successful silicon solutions.

You will lead a team of engineers and work closely with cross-functional groups across geographies -- including RTL design, verification, CAD, and integration teams. Your role will be pivotal in shaping the physical design strategy, ensuring design convergence, and maintaining signoff integrity across timing, power, and area metrics.

Minimum Qualifications:

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 8+ years of Hardware Engineering or related work experience.
• Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 7+ years of Hardware Engineering or related work experience.
• PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience.

Principal Duties and responsibilities:

• Demonstrate proven experience in executing responsibilities across multiple sites.
• Lead and manage a team across multiple functions.
• Design closure and tapeout expertise in advanced technology nodes.
• Complete ownership of PnR implementation, including Floor planning, Placement, CTS, and post-route activities on the cutting-edge nodes.
• Possess mandatory signoff knowledge, including STA, Power Analysis, FV, Low Power Verification and PV.
• Collaborate effectively to resolve issues related to constraints validation, verification, STA, Physical Design and tapeout
• Understand deep sub-micron design challenges, including leakage power, signal integrity, and DFM.
• Support pre-sales and business development activities by evaluating technical feasibility and providing design expertise.
• Provide technical leadership during design reviews and executive-level customer engagements.
• Drive resolution of customer-reported issues by coordinating across design, verification, firmware, software, and validation teams.

Minimum Qualifications

• Bachelor's or Master’s degree in Electrical/Electronics Engineering and 17- 25 years of Hardware/VLSI Engineering specializing in Physical Design and timing signoff for high-speed SoCs.

Preferred Qualifications:

• Excellent hands-on experience on Floor planning, PnR and STA flows
• Good knowledge of Placement/Clock Tree Synthesis (CTS), Low Power/High Performance optimization etc.
• Thorough understanding of signoff domains- LEC/CLP/PDN etc.
• 18+ years of experience with Physical Design and timing signoff expertise in latest tech nodes (e.g., 2nm/3nm/4nm/5nm)

Applicants:

Qualcomm is an equal opportunity employer.

If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may email [e-mail] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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