Senior RF/mmWave IC Design Engineer, 24 months

EURAXESS Ireland; Dublin; Remote; EUR 65.000 - 80.000; Vollzeit

Zusammenfassung

University College Dublin in Ireland seeks a Senior RF/mmWave IC Design Engineer to drive engineering execution, layout synthesis, and top-level integration of a sub-THz transceiver SoC.

Reporting to the Principal Investigator, you will lead cross-functional RF/analog/digital/test teams, define sign-off methodologies, and develop post-silicon validation frameworks to deliver tape-out-ready components and anchor an early-stage startup venture.

Qualifikationen

• PhD or MSc in RF / Microwave / mmWave IC Design or related.
• 5–10+ years hands-on RF/Analog/Mixed-Signal IC design experience.
• Lead RF/mmWave transceiver architecture development and block-level specification definitions.
• Design and optimize high-frequency transmitter and receiver building blocks including PAs, LNAs, Mixers, and LO distribution.
• Execute EM-aware passive design, modeling, and layout optimization.
• Drive full-custom layout implementation, managing parasitics, EM coupling, device matching, and reliability.
• Lead tape-out preparation and sign-off flows.
• Define silicon characterization methodologies and support lab validation and measurement correlation.
• Demonstrate strong English communication and project-reporting skills.
• Experience above 100 GHz and with beamforming architectures.
• Deep expertise in full-custom RF/analog IC design and layout verification.

Aufgaben

• Direct engineering execution for sub-THz transceiver SoC development.
• Coordinate RF/analog/digital/test teams to ensure design integrity.
• Oversee floorplanning, layout supervision, and sign-off methodologies.
• Define post-silicon validation frameworks and tape-out readiness.
• Lead silicon validation and lab bring-up activities and collaboration with startup ventures.

Kenntnisse

RF IC design

mmWave design

Full-custom layout

Engineering leadership

EM-aware design

Tape-out & sign-off

Mentoring engineers

Ausbildung

PhD or MSc in RF/Microwave/mmWave IC Design

Tools

Cadence Virtuoso

Calibre/Assura/PVS/Pegasus

Jobbeschreibung

Organisation/Company University College Dublin Research Field Engineering » Electrical engineering Engineering » Electronic engineering Researcher Profile Recognised Researcher (R2) Application Deadline 12 Nov 2026 - 12:33 (UTC) Country Ireland Type of Contract Temporary Job Status Full-time Is the job funded through the EU Research Framework Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No

Offer Description

Applications are invited for a temporary post of a Senior RF/mmWave IC Design Engineer within UCD School of Electrical and Electronic Engineering.

This technical leadership role exists to direct the engineering execution, layout synthesis, and final top-level integration of a sub-THz transceiver SoC. Operating within UCD's deep-tech commercialization framework, the appointee translates project milestones into scalable silicon architectures. The position serves as a principal coordinator across cross-functional RF, analog, digital, and test teams, ensuring technical synchronization and design integrity.

Reporting to the Principal Investigator, the appointee maintains primary technical accountability for block-level circuit delivery, floorplanning, and layout supervision. Key responsibilities include establishing sign-off methodologies and defining comprehensive post-silicon validation frameworks to deliver tape-out-ready components optimized to anchor an early-stage deep-tech startup venture.

The mmWave TRx project, funded under an Enterprise Ireland Commercialisation Fund programme, is focused on the development of a highly integrated sub-THz transceiver SoC for next-generation communication and sensing applications. The project combines cutting-edge RFIC design, antenna integration, and silicon validation, with the definitive objective of creating robust technology suitable for a future venture-backed spin-out company.

Salary Range: €65,000 - €80,000 Per Annum
Appointment on the above range will be dependent upon qualifications and experience.

Closing date: 12:00 noon (local Irish time) on 12 November 2026.

Applications must be submitted by the closing date and time specified. Any applications which are still in progress at the closing time of 12:00 noon (Local Irish Time) on the specified closing date will be cancelled automatically by the system. UCD are unable to accept late applications.

UCD do not require assistance from Recruitment Agencies. Any CV's submitted by Recruitment Agencies will be returned.

RF / mmWave / sub-THz IC Design, Custom RF/Analog Layout & Parasitic Extraction, Electromagnetic (EM) Modeling & Passive Structure Optimization, Silicon Characterization, Validation, and Lab Bring-up, Cadence Virtuoso Environment

Additional Information

Eligibility criteria

Mandatory:

• PhD or MSc in RF / Microwave / mmWave IC Design, Microelectronics, or a related technical engineering discipline.
• 5-10+ years of hands-on industrial or advanced research experience in RF/Analog/Mixed-Signal IC design.
• Lead RF/mmWave transceiver architecture development and block-level specification definitions.
• Design and optimize high-frequency transmitter and receiver building blocks including Power Amplifiers (PAs), Low Noise Amplifiers (LNAs), Mixers, and Frequency Generation/LO distribution.
• Execute EM-aware passive design, modeling, and layout optimization.
• Drive full-custom layout implementation, managing parasitic effects, EM coupling, device matching, and reliability.
• Perform robust post-layout simulations and PVT/corners verification; lead tape-out preparation and sign-off flows.
• Define silicon characterization methodologies and support lab validation and measurement correlation.
• Perform strong and consistent team leadership and mentoring of engineers as required.
• Demonstrate excellent written and verbal English language skills, with the ability to prepare professional project reports as required and other technical documentation.
• Demonstrate how you can positively contribute to fostering an inclusive environment and a high level of awareness of the equality, diversity, and inclusion agenda.
• Experience operating above 100 GHz (sub-THz design domain).
• Experience with digitally-assisted RF calibration and process variation compensation techniques.
• Familiarity with array / beamforming architectures.
• A proven tape-out history with a successful track record of deep-micron silicon realization.
• Deep engineering expertise in full-custom RF/analog IC design, layout implementation, and physical verification.
• Strong understanding of high-frequency design challenges: device matching, symmetry, parasitics (R, C, coupling), EM/IR, and antenna effects.
• Knowledge and hands-on experience with advanced packaging techniques for high-speed/mmWave IC designs (e.g., flip-chip, wafer-level packaging, antenna-on-package integration).
• Deep expertise in performance-critical full-custom layout and advanced physical verification suites (Calibre, Assura, PVS, or Pegasus).
• Experience with deep sub-micron CMOS and FD-SOI platforms (e.g., GlobalFoundries FD-SOI).