Senior Staff Mold Process Engineer (Encapsulation)

Infineon Technologies AG

Indonesia

On-site

IDR 450,000,000 - 750,000,000

Full time

14 days+

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Job summary

Infineon Technologies AG in Indonesia seeks a Senior Staff Engineer Encapsulation to lead molding process development in our advanced manufacturing facility. You will drive process improvement, enable ramp-ups and ensure cost targets are met while maintaining quality in a cleanroom environment.

You will apply DoE, DFMEA, and statistical tools, mentor teams, and collaborate across packaging and equipment engineering to deliver robust, scalable molding solutions.

Qualifications

  • Master or bachelor’s degree in engineering or physical science.
  • Minimum 5 years in Mold Process Development.
  • Experience in IC Packaging concept and process/equipment engineering.
  • Knowledge of DoE and statistical tools and metrology software.

Responsibilities

  • Drive innovation, pre-development and development of molding processes.
  • Ensure timely development of robust molding processes per timeline, yield and cost targets.
  • Develop unit processes per the Process Development Handbook.
  • Advocate Design for Manufacturing and Design for Cost.
  • Solve complex problems using appropriate problem-solving tools.
  • Lead definition of process/equipment/material strategies aligned with the roadmap.
  • Support end-to-end project activities for ramp-up.

Skills

Mold Process Development
Statistical tools
DoE
P/DFMEA
DMAIC
8D Methodology
Molding process assembly
IC Packaging concept

Education

Master / bachelor’s degree in engineering and physical science

Tools

JMP
CEDA
Smart Scope
Hisomet

Job description

Infineon Technologies AG in Indonesia seeks a Senior Staff Engineer Encapsulation to lead molding process development in our advanced manufacturing facility. You will drive process improvement, enable ramp-ups and ensure cost targets are met while maintaining quality in a cleanroom environment.

You will apply DoE, DFMEA, and statistical tools, mentor teams, and collaborate across packaging and equipment engineering to deliver robust, scalable molding solutions.

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