Senior Staff Eningeer Unit Process Engineering

Infineon; Batam; On-site; IDR 350,000,000 - 650,000,000; Full time

Job summary

Infineon Technologies Indonesia in Batam seeks a Senior Staff Engineer in Unit Process Engineering (Test area) to lead process development, equipment management, and yield optimization in semiconductor backend packaging. You will mentor engineers and technicians, drive AI and automation projects, implement AOI tools, and collaborate across functions to ensure quality and on-time product readiness.

This role demands strong leadership, deep AOI expertise, and sustained focus on KPI-driven

Qualifications

• Requires 8+ years in Semiconductor Backend Packaging.
• Bachelor's or Master's in Mechanical, Material, Chemical, or Electrical Engineering.
• 5+ years leading engineering teams.
• Deep expertise in at least 2 AOI technologies.

Responsibilities

• Optimize scan processes, run DOE, establish Cpk/Ppk.
• Manage AOI tools and implement AI/Advanced Automation projects.
• Define accept/reject criteria, lead failure analysis.
• Drive Yield at Final Test.
• Lead engineers & technicians, set KPIs, drive competency.
• Develop scan recipes, FMEA, Control Plans for new products.
• Lean/Six Sigma, reduce cycle time & false calls.
• Present data, support audits, engage supplier.

Skills

AOI technologies

Leadership

DOE

Process optimization

Education

Bachelors/Masters Eng

Tools

AOI equipment

Job description

As Senior Staff Engineer Unit Process Engineering in Test area, you’re responsible for Process Development, Equipment Management, Quality & Defect Engineering, Yield Engineering, Continuous Improvement, NPI Support, Customer interface, and leading engineers & technicians.

Your Role Key responsibilities in your new role

• Optimize scan processes, run DOE, establish Cpk/Ppk
• Manage AOI tools, Implement new projects related to Artificial Intelligence (AI) & Advanced Automation
• Define accept/reject criteria, lead failure analysis
• Drive Yield at Final Test
• Lead engineers & technicians, set KPIs, drive competancy
• Develop scan recipes, FMEA, Control Plans for new products
• Lean/Six Sigma, reduce cycle time & false calls
• Present data, support audits, engage supplier

Your Profile Qualifications and skills to help you succeed

• A Bachelor/Master Degree in Mechanical, Material, Chemical, or Electrical Engineering
• >8 years experience in Semiconductor Backend Packaging
• >5 years managing engineering teams
• Deep expertise in at least 2 AOI technologies

Soft Skills

• Good communication in cross-functional collaboration, and customer communication.

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