Senior Staff Engineer Technology Integration

Infineon Technologies; Indonesia; On-site; IDR 400,000,000 - 700,000,000; Full time

Job summary

Infineon Technologies is seeking a senior engineer to lead critical decisions for its driver portfolio. You will analyze stress results to understand failure modes and reliability, and you will form and lead multidisciplinary teams to solve complex technical issues.

You will also define problem statements and create robust solving frameworks to drive project success. Collaboration with Process Development to characterize processes, and translating development requirements into concrete inputs

Qualifications

• Bachelor’s/Master’s/PhD in Electrical & Electronics Engineering or related field.
• 5+ years of hands-on experience in leaded package assembly processes in the semiconductor backend.
• 3+ years in a lead capacity with proven technical leadership.
• Strong fundamentals and problem-solving abilities spanning technology, materials, design, and manufacturing interactions.
• Specialized knowledge in galvanic isolation, material science and electrical insulation.

Responsibilities

• Lead technical decision-making for Infineon’s driver portfolio.
• Analyze stress results to evaluate failure modes, models, and reliability levels.
• Form and lead multidisciplinary teams to solve complex technical issues.
• Define clear problem statements and structure effective solving frameworks.
• Partner with Process Development to characterize processes and process interactions.
• Translate project development requirements into defined process inputs and outputs.

Skills

Technical leadership

Stress analysis

Problem solving

Cross-disciplinary collaboration

Galvanic isolation

Material science

Electrical insulation

Team leadership

Education

Bachelor's degree in Electrical & Electronics Engineering

Master's degree or PhD preferred

Job description

Lead technical decision-making for Infineon’s driver portfolio.

Your Role

• Lead technical decision-making for Infineon’s driver portfolio.
• Analyze stress results to evaluate failure modes, models, and reliability levels.
• Form and lead multidisciplinary teams to solve complex technical issues.
• Define clear problem statements and structure effective solving frameworks.
• Partner with Process Development to characterize individual processes and process interactions.
• Translate project development requirements into defined process inputs and outputs.

Your Profile

• Holds a Bachelor’s, Master’s, or Doctoral degree in Electrical & Electronics Engineering, Mechanical Engineering, Mechatronics, or Manufacturing Engineering.
• Possesses over 5 years of hands‑on experience within leaded package assembly processes in the semiconductor backend.
• Demonstrates a track record of technical leadership with a minimum of 3 years in a lead capacity.
• Exhibits robust technical fundamentals and advanced problem‑solving abilities, particularly in analyzing the complex interactions between technology, materials, design, and manufacturing processes.
• Specialized knowledge in galvanic isolation, material science, and electrical insulation.
• Proven experience in simulation methodologies and package design optimization.

Equal Opportunity and Diversity

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.