Principal Engineer End of Line

Infineon; Batam; On-site; IDR 450,000,000 - 650,000,000; Full time

Job summary

Infineon Technologies AG seeks an experienced Principal Engineer Operations to lead Molding and Mark Trim Form processes for SON products. You will drive improvements in yield, quality, productivity, and cost, while optimizing processes and equipment to boost manufacturing performance.

You will develop and maintain process documentation, FMEA, control plans, and work instructions, collaborating with Production, Quality, and Product Test Engineering teams, and mentoring junior engineers to build

Qualifications

• Bachelor's or Master's Degree in Engineering, Physics, or related field.
• Minimum 10 years of semiconductor assembly manufacturing experience.
• Strong knowledge of DOE, SPC, FMEA, Six Sigma, and statistical analysis.
• Proven success in yield improvement, process optimization, and cost reduction.
• Excellent troubleshooting, leadership, communication, and project management skills.
• Ability to work effectively in a cross-functional, multinational environment.

Responsibilities

• Lead Molding and Mark Trim Form processes for SON products.
• Drive improvements in yield, quality, productivity, and cost.
• Optimize processes and equipment to improve manufacturing performance.
• Investigate and resolve process and quality issues using structured problem-solving methods.
• Develop and maintain process documentation, FMEA, control plans, and work instructions.
• Mentor junior engineers and collaborate with Production, Quality, and Product Test Engineering teams.

Skills

Process optimization

DOE

SPC

FMEA

Six Sigma

Statistical analysis

Leadership

Cross‑functional collaboration

Education

Bachelor's or Master's Degree in Engineering, Physics, or related field

10+ years semiconductor assembly manufacturing experience

Tools

Transfer Molding (BESI, ASM, Asahi)

Mark Form Operations (BESI, ASM)

Job description

We are seeking an experienced Principal Engineer Operations to lead Molding and Mark Trim Form processes for SON products, driving improvements in yield, quality, productivity, and cost. Lead Molding and Trim Form engineering activities for SON products. Optimize processes and equipment to improve manufacturing performance. Investigate and resolve process and quality issues using structured problem-solving methods. Drive root cause analysis, corrective actions, and continuous improvement initiatives. Develop and maintain process documentation, FMEA, control plans, and work instructions. Collaborate with Production, Quality, and Product Test Engineering teams. Provide technical leadership and mentoring to junior engineers.

Qualifications

• Bachelor's or Master's Degree in Engineering, Physics, or related field.
• Minimum 10 years of semiconductor assembly manufacturing experience.
• Transfer Molding (BESI, ASM, Asahi) Marking Processes Trim & Form Operations (BESI, ASM) TDSON or similar leadframe-based packages Strong knowledge of DOE, SPC, FMEA, Six Sigma, and statistical analysis.
• Proven success in yield improvement, process optimization, and cost reduction.
• Excellent troubleshooting, leadership, communication, and project management skills.
• Ability to work effectively in a cross-functional, multinational environment.

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion.

We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience.

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