Senior Mechanical Engineer- Semiconductor

Michael Page; Hong Kong; On-site; HKD 600,000 - 900,000; Full time

Benefits offered by this job

Competitive compensation

Job summary

Michael Page is seeking an experienced Mechanical Design Lead for a multinational semiconductor client in Hong Kong. You will drive concept-to-production design of assembly and packaging equipment modules, focusing on wafer handling and precision automation.

This role requires strong NPI background and hands-on CAD proficiency. Fluency in English and Chinese is preferred, with collaboration across software, manufacturing, and quality teams to deliver robust engineering solutions.

Qualifications

• Bachelor's degree in Mechanical Engineering or closely related field.
• 5+ years of mechanical design experience in semiconductor equipment, automation, precision machinery, or related industries.
• Strong knowledge of product development and NPI processes.
• Hands-on CAD experience with SolidWorks, Creo, Inventor or equivalent.

Responsibilities

• Lead the mechanical design and development of semiconductor assembly and packaging equipment modules from concept to production release.
• Participate in NPI projects ensuring performance, reliability, manufacturability, and cost targets.
• Design and optimize precision mechanical systems including wafer handling, pick-and-place, and motion modules.
• Conduct engineering calculations, simulations, tolerance analysis, and design verification activities.
• Collaborate with software, controls, process, manufacturing, and quality teams to deliver integrated solutions.
• Support prototype builds, testing, troubleshooting, and design improvements based on feedback.
• Drive continuous improvement and cost reduction through design optimization and standardization of components.
• Prepare engineering documentation, drawings, BOMs, specifications, and technical reports.
• Support supplier qualification and component selection activities for new projects.

Skills

Mechanical design

NPI experience

GD&T

Wafer handling

Cross-functional collaboration

English & Chinese

Education

Bachelor's Degree in Mechanical Engineering

Tools

SolidWorks

Creo

Inventor

Job description

• Lead new product development for semiconductor
• Join a market-leading semiconductor manufacturer

About Our Client

Our client is a well-established multinational semiconductor company.

Job Description

• Lead the mechanical design and development of semiconductor assembly and packaging equipment modules from concept to production release.
• Participate in NPI (New Product Introduction) projects, ensuring product performance, reliability, manufacturability, and cost targets are achieved.
• Design and optimize precision mechanical systems, including wafer handling, pick-and-place, and motion-related modules.
• Conduct engineering calculations, simulations, tolerance analysis, and design verification activities.
• Collaborate with software, controls, process, manufacturing, and quality teams to deliver integrated engineering solutions.
• Support prototype builds, testing, troubleshooting, and design improvements based on customer feedback and field performance.
• Drive continuous improvement and cost reduction initiatives through design optimization and component standardization.
• Prepare engineering documentation, drawings, BOMs, specifications, and technical reports.
• Support supplier qualification and component selection activities for new projects.

The Successful Applicant

• Bachelor's Degree or above in Mechanical Engineering, Mechatronics Engineering, or a related discipline.
• 5+ years of mechanical design experience within semiconductor equipment, automation equipment, precision machinery, or advanced manufacturing industries.
• Solid experience in product development, NPI, and mechanical module design.
• Hands-on experience in CAD software such as SolidWorks, Creo, Inventor, or similar platforms.
• Strong understanding of GD&T, tolerance stack-up analysis, machine assembly, and engineering fundamentals.
• Experience with wafer handling, die bonding, pick-and-place systems, or precision automation equipment is highly preferred.
• Good problem-solving skills with the ability to conduct root cause analysis and implement engineering solutions.
• Strong communication and stakeholder management skills.
• Proficiency in English and Chinese.

What's on Offer

• Competitive compensation package with performance bonus.
• Regional and global project exposure within a multinational environment.

Quote job ref: JN-102026-7119221