Director, RFS

ASTRI - Hong Kong Applied Science and Technology Research Institute

Hong Kong

On-site

HKD 558,000 - 892,800

Full time

14 days+
Application generator

A complete application in a minute — tailored resume and cover letter, ready to send.

Get past ATS filters

Benefits offered by this job

Paid leave
Medical insurance
MPF contributions
Performance-linked gratuity

Job summary

ASTRI - Hong Kong Applied Science and Technology Research Institute is looking for a leader in their Core Competency Group focused on next-generation mmWave RFICs. The role involves hands-on design, leadership, and end-to-end project ownership from concept to silicon.

The ideal candidate will have a PhD in Electrical/Electronics Engineering, over ten years of RFIC design experience, and proficiency in Cadence tools. This role offers competitive salary and benefits, with an emphasis on innovation and technical strategy in patents and publications.

Qualifications

  • 10+ years of RFIC design experience with multiple tape-outs.
  • Ability to drive first-time-right silicon.
  • Strong leadership and mentoring capabilities.

Responsibilities

  • Lead and mentor RFIC engineers in project delivery.
  • Define system architecture for mmWave transceivers.
  • Design and optimize mmWave circuits for performance.

Skills

Leadership in engineering teams
mmWave RF design expertise
Cadence simulation proficiency
Advanced knowledge of RFICs
Strong communication skills

Education

PhD in Electrical/Electronics Engineering / RF / Microwave

Tools

Cadence Virtuoso
EM simulation tools
DRC/LVS tools

Job description

Hong Kong Applied Science and Technology Research Institute (ASTRI) is founded in 2000 by the Government of the Hong Kong Special Administrative Region. As Hong Kong’s largest government-funded research and development centre, ASTRI is a key force and super‑connector driving innovation and technology advancement in Hong Kong, the Greater Bay Area, and the global innovation ecosystem. This role is strengthened through its merger with Nano and Advanced Materials Institute (NAMI).

Committed to bringing high‑impact research from lab to market, ASTRI advances interdisciplinary, market‑driven R&D that delivers practical innovations for industry and meaningful benefits for society.

Its technological strengths and capabilities enable AI‑powered, cross‑disciplinary ICT and advanced materials solutions across Smart City, Financial Technologies, Digital Health and Life Sciences, New Industrialisation and Intelligent Manufacturing, Application‑Specific Integrated Circuits (ASIC) and Advanced Electronics, New Energy and Energy Storage, and Green and ESG Technologies.

Over the years, ASTRI has cultivated a strong pool of I&T talent and earned numerous international awards for its pioneering innovations and contributions to industry and the community. Following the merger with NAMI, ASTRI’s cumulative global patent portfolio has grown to over 1,500, with more than 2,200 technologies successfully transferred to industry.

With enhanced scale and capabilities, ASTRI is uniquely positioned to elevate Hong Kong’s innovation capacity, accelerate technology commercialisation, and drive societal and economic progress through world‑class applied research.

Job Responsibilities
  • Serves as the leader of Core Competency Group to lead and drive the architecture, design, and delivery of next‑generation mmWave RFICs. This role combines deep technical leadership, hands‑on design capability, and end‑to‑end ownership from concept to silicon. Lead & mentor RFIC engineers and technical leads.
  • Define system and RFIC architecture for mmWave transceivers (24‑60 GHz) and other RF projects. Lead advanced RFIC development, including direct conversion (zero‑IF) architecture design: IQ design and optimization, LO distribution and phase noise management, DC offset, LO leakage, flicker noise mitigation, IQ mismatch calibration strategies, Drive architecture trade‑offs vs low‑IF / superheterodyne designs.
  • Design RF/mmWave circuits in RFIC: oversee and contribute to design of LNAs, PAs, mixers, VCOs, PLLs, frequency synthesizers, phase shifters, beamforming front‑ends. Optimize designs for NF, gain, linearity, power efficiency and thermal performance, transceivers, phased‑array systems.
  • Drive RFIC design flows using industry tools: Cadence Virtuoso – schematic design & layout, SpectreRF for RF simulation, ADE Explorer/Assembler – design verification and corner analysis, Virtuoso Layout Suite – physical implementation, RF system simulation & Tools (SystemVue / MATLAB).
  • Experience with EM simulation tools (packaging, interconnect, antennas). Validate parasitics, coupling, and mmWave layout effects, mmWave integration & packaging (antenna‑in‑package/ antenna‑on‑chip, beamforming arrays, RF‑package co‑design, interconnect modeling and loss optimisation, thermal and reliability considerations.
  • Perform verification & signoff (DRC/LVS tools, EM‑aware design signoff for mmWave circuits, statistical analysis and Monte Carlo simulations).
  • Own silicon development & validation (full lifecycle: specification, architecture, design, tape‑out & validation. Lead silicon bring‑up and debug: mmWave measurement setups.
  • Implement calibration strategies (DC offset correction, IQ imbalance calibration, LO leakage suppression). Drive yield improvement across Process, Voltage Temperature and process corners.
  • Define best practices in mmWave layout and routing, substrate noise isolation, modelling and verification.
  • Interface with system architects, DSP team, packaging and antenna team, foundries and external partners.
  • Secure R&D fundings.
  • Develop and contribute to innovation & technical strategy in patents and publications, technology roadmap in RFICs.
Job Requirements
  • PhD in Electrical/Electronics Engineering / RF / Microwave.
  • More than 10 years RFIC design experience with proven record of multiple silicon tape‑outs (RF/mmWave).
  • Drive architectural thinking and system‑level insight in RFIC.
  • Proven ability to lead, mentor and scale engineering teams.
  • Ability to drive first‑time‑right silicon, first‑pass silicon success rate is desirable, with hands‑on experience in CMOS technologies.
  • Possess strong knowledge and expertise in mmWave RF designs with considerations of direct conversion impairments: LO leakage, flicker noise (1/f), DC offsets, IQ imbalance.
  • Advanced knowledge and skills of RF simulation (PSS, PNoise, harmonics) and layout parasitics and EM effects.
  • Proficiency in Cadence (Virtuoso platform – schematic & layout, SpectreRF simulation – PSS/PNoise), EM tools, DRC/LVS flows (Calibre).
  • Proven ability to secure R&D fundings.
  • Industry and commercialisation experience in RFICs is desirable.
  • Professional language skill in English & Putonghua is required. Cantonese speaking skill is desirable.
  • Good leadership and communication skills.
  • Overseas candidates are welcomed to apply, with sponsorship of employment visa for the right candidate.
  • Live ASTRI values.

The appointment will be on renewable contract terms with a competitive salary and performance‑linked gratuity. Fringe benefits include paid leave, medical, insurance coverage and contribution to MPF. The incumbent will normally work a five‑day week.

For interested parties, please submit your application with detailed CV within two weeks of the post date. Applicants are encouraged to submit their applications as soon as possible. The review of applications will continue until the post is filled.

The resume should not include any sensitive personal information such as ID card no. or travel document number, etc.

Position offer is subject to the applicant’s experience and academic qualification. Only short‑listed candidates will be notified. ASTRI reserves the right not to fill the position.

ASTRI is an Equal Opportunities Employer. Personal data provided by job applicants will be used exclusively for recruitment only. For details, please refer to ASTRI Privacy Policy Statement.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Wireless Networks & Services - Associate Principal Engineer / Lead Engineer / Engineering Associate
Wireless Networks & Services - Associate Principal Engineer / Lead Engineer / Engineering Associate

ASTRI - Hong Kong Applied Science and Technology Research Institute • Hong Kong Island

On-site
HKD 60,000 - 100,000
Paid Leave
Medical Insurance
MPF Contribution
+1
Senior Manager/ Manager I, Client Development
Senior Manager/ Manager I, Client Development

ASTRI - Hong Kong Applied Science and Technology Research Institute • Hong Kong

On-site
HKD 600,000 - 1,000,000
Paid leave
Medical insurance
MPF
5G/6G Embedded Systems Design - Principal Engineer / Lead Engineer / Senior Engineer / Engineer
5G/6G Embedded Systems Design - Principal Engineer / Lead Engineer / Senior Engineer / Engineer

Research Institute Company Limited • Hong Kong Island

On-site
Paid leave
Medical insurance coverage
Contribution to MPF
5G/6G Protocol and Application Software Design - Principal Engineer / Lead Engineer / Engineer
5G/6G Protocol and Application Software Design - Principal Engineer / Lead Engineer / Engineer

ASTRI - Hong Kong Applied Science and Technology Research Institute • Hong Kong Island

On-site
HKD 60,000 - 100,000
Performance Bonuses
Medical Insurance
MPF Contributions
+1
RFIC/mmWave Architecture Director
RFIC/mmWave Architecture Director

ASTRI - Hong Kong Applied Science and Technology Research Institute • Hong Kong

On-site
Paid leave
Medical insurance
MPF contributions
+1
Engineer, Software
Engineer, Software

ASTRI - Hong Kong Applied Science and Technology Research Institute • Hong Kong

On-site
HKD 300,000 - 600,000
Paid leave
Medical insurance coverage
Contribution to MPF
Principal Engineer/Associate Principal Engineer, 3D Package
Principal Engineer/Associate Principal Engineer, 3D Package

ASTRI - Hong Kong Applied Science and Technology Research Institute • Hong Kong

On-site
HKD 900,000 - 1,200,000
Paid leave
Medical insurance
MPF contribution
+1
FPGA Design - Principal Engineer / Lead Engineer / Senior Engineer / Engineer
FPGA Design - Principal Engineer / Lead Engineer / Senior Engineer / Engineer

ASTRI - Hong Kong Applied Science and Technology Research Institute • Hong Kong Island

On-site
HKD 30,000 - 60,000
Paid leave
Medical insurance
MPF contribution
Smart Mobility - Principal Engineer/Associate Principal Engineer/Senior Lead Engineer/Lead Engineer
Smart Mobility - Principal Engineer/Associate Principal Engineer/Senior Lead Engineer/Lead Engineer

Research Institute Company Limited • Hong Kong Island

On-site
HKD 600,000 - 900,000
Paid leave
Medical insurance
Contribution to MPF
Senior Lead Engineer/Lead Engineer/Senior Engineer/Engineer/Engineering Associate, Smart Mobility
Senior Lead Engineer/Lead Engineer/Senior Engineer/Engineer/Engineering Associate, Smart Mobility

ASTRI - Hong Kong Applied Science and Technology Research Institute • Hong Kong Island

On-site
Competitive salary and performance-linked pay
Paid leave and medical insurance coverage
Contribution to MPF