5G/6G Embedded Systems Design - Principal Engineer / Lead Engineer / Senior Engineer / Engineer

Research Institute Company Limited

Hong Kong Island

On-site

HKD 334,800 - 669,600

Full time

14 days+
Application generator

An application made for this job — a tailored resume and cover letter that speak straight to the posting.

Get past ATS filters

Benefits offered by this job

Paid leave
Medical insurance coverage
Contribution to MPF

Job summary

A leading research institute in Hong Kong is seeking qualified professionals for DSP solution development in 5G/6G R&D projects. The role involves developing high-performance wireless communications systems and requires a strong background in relevant engineering disciplines. Fresh graduates are welcome to apply, and competitive salary packages are offered, including benefits.

Qualifications

  • PhD holder or Master’s/Bachelor’s in Computer Science, Engineering, Physics, or Mathematics.
  • Fresh graduates may also be considered.
  • Experience in programming languages like C/C++, Assembly preferred.

Responsibilities

  • Develop high performance wireless communications DSP solutions for 5G/6G.
  • Optimize DSP solutions for real-time performance with hardware acceleration.
  • Troubleshoot and set up hardware platforms for development.

Skills

Programming in C/C++
Knowledge of wireless communications standards
DSP/embedded system programming
Real Time software development
Python

Education

PhD or Master’s/Bachelor’s in relevant disciplines

Job description

Select how often (in days) to receive an alert:

Ref. ID: CTO/CT/BSOL/900

Location:

HK

Hong Kong Applied Science and Technology Research Institute (ASTRI) was founded by the Government of the Hong Kong Special Administrative Region in 2000 with the mission of enhancing Hong Kong’s competitiveness through applied research.

ASTRI’s core R&D competence in various areas is grouped under five Technology Divisions: Advanced Electronic Components and Systems; Artificial Intelligence and Trust Technologies; Communications Technologies; IoT Sensing and AI Technologies; and Intelligent Perception and Control Technologies.

It is applied across six core areas which are Smart City, Financial Technologies, New Industrialisation and Intelligent Manufacturing, Digital Health, Application Specific Integrated Circuits and Metaverse.

Over the years, ASTRI has nurtured a pool of research, I&T talents and received numerous international awards for its pioneering innovations as well as outstanding business and community contributions.

As of 2023/24, ASTRI has transferred more than 1,500 technologies to the industry and has been granted over 1,100 patents in the Mainland, the US, and other countries.

To support our constant endeavour to position Hong Kong as a world-class smart city and an international hub of innovation and technology, we are seeking qualified professionals to fill the following position(s):

Job Responsibilities:

  • Participate and contribute to physical layer (PHY) DSP solution development in multiple platforms in ASTRI’s 5G/6G R&D projects
  • Engage in activities including the followings:
    • Develop high performance wireless communications digital signal processing (DSP) solutions for 5G/6G L1 Physical (PHY) layer
    • Real time system implementation and optimization with hardware acceleration platforms
    • Develop driver real time performance to interact with hardware accelerators like FPGA
    • Optimize and troubleshoot DSP solutions in target platforms to fulfil high performance and real time deadline requirements
    • Troubleshoot and setup hardware platforms or BSP (e.g. Linux system) for development
    • Build up know-hows on 5G/6G standardization

Job Requirements:

  • PhD holder or Master’s or Bachelor’s in Computer Science, Computer Engineering, Electrical Engineering, Electronic Engineering, Information Engineering, Telecommunications, Physics and Mathematics relevant disciplines
  • Successfully completed the undergraduate/postgraduate program
  • Fresh graduates may also be considered
  • Experiences in programming language such as C/C++, Assembly, are preferred
  • Knowledge of wireless communications standard, such as 5/6G, ORAN, WiFi, Bluetooth a plus
  • Knowledge of DSP/embedded system programming and optimization a plus
  • Experiences in Real Time software development a plus
  • Experiences in embedded system development in ARM/X86 platform development a plus
  • Experiences in programming/scripting language such as Python, C# a plus
  • Experiences in BSP development and troubleshooting such as Linux a plus
  • Lives ASTRI values

Application

The appointment will be on renewable contract terms with a competitive salary and performance-linked variable pay. Fringe benefits include paid leave, medical, insurance coverage and contribution to MPF. The incumbent will normally worka five-day week.

For interested parties, please submit your application with detailed CV within two weeks of the post date. Applicants are encouraged to submit their applications as soon as possible. The review of applications will continue until post is filled.

The resume shouldnotinclude any sensitive personal information such as ID card number or travel document number etc.

Position offer is subject to the applicant’s experience and academic qualification. Only short-listed candidates will be notified. ASTRI reserves the right not to fill the position.

ASTRI is an Equal Opportunities Employer. Personal data provided by job applicants will be usedexclusivelyfor recruitmentonly. For details, please refer toASTRI Privacy Policy Statement .

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Networking Software (5G Network Integration) - Senior Engineer / Engineer
Networking Software (5G Network Integration) - Senior Engineer / Engineer

ASTRI - Hong Kong Applied Science and Technology Research Institute • Hong Kong Island

On-site
HKD 40,000 - 60,000
Paid leave
Medical insurance coverage
Contribution to MPF
5G/6G Solution Verification - Lead Engineer / Senior Engineer / Engineer
5G/6G Solution Verification - Lead Engineer / Senior Engineer / Engineer

ASTRI - Hong Kong Applied Science and Technology Research Institute • Hong Kong Island

On-site
Paid leave
Medical insurance coverage
Contribution to MPF
5G/6G Protocol and Application Software Design - Principal Engineer / Lead Engineer / Engineer
5G/6G Protocol and Application Software Design - Principal Engineer / Lead Engineer / Engineer

ASTRI - Hong Kong Applied Science and Technology Research Institute • Hong Kong Island

On-site
HKD 60,000 - 100,000
Performance Bonuses
Medical Insurance
MPF Contributions
+1
Wireless Networks & Services - Associate Principal Engineer / Lead Engineer / Engineering Associate
Wireless Networks & Services - Associate Principal Engineer / Lead Engineer / Engineering Associate

ASTRI - Hong Kong Applied Science and Technology Research Institute • Hong Kong Island

On-site
HKD 60,000 - 100,000
Paid Leave
Medical Insurance
MPF Contribution
+1
Engineering Associate, Embedded System Design
Engineering Associate, Embedded System Design

ASTRI - Hong Kong Applied Science and Technology Research Institute • Hong Kong Island

On-site
Paid leave
Medical insurance
MPF contribution
FPGA Design - Principal Engineer / Lead Engineer / Senior Engineer / Engineer
FPGA Design - Principal Engineer / Lead Engineer / Senior Engineer / Engineer

ASTRI - Hong Kong Applied Science and Technology Research Institute • Hong Kong Island

On-site
HKD 30,000 - 60,000
Paid leave
Medical insurance
MPF contribution
5G/6G Protocol and Application Software Design - Senior Lead Engineer / Lead Engineer
5G/6G Protocol and Application Software Design - Senior Lead Engineer / Lead Engineer

ASTRI - Hong Kong Applied Science and Technology Research Institute • Hong Kong Island

On-site
HKD 600,000 - 1,000,000
Paid leave
Medical coverage
Insurance coverage
+1
Senior Lead Engineer/Lead Engineer/Senior Engineer/Engineer/Engineering Associate, Smart Mobility
Senior Lead Engineer/Lead Engineer/Senior Engineer/Engineer/Engineering Associate, Smart Mobility

ASTRI - Hong Kong Applied Science and Technology Research Institute • Hong Kong Island

On-site
Competitive salary and performance-linked pay
Paid leave and medical insurance coverage
Contribution to MPF
Smart Mobility - Principal Engineer/Associate Principal Engineer/Senior Lead Engineer/Lead Engineer
Smart Mobility - Principal Engineer/Associate Principal Engineer/Senior Lead Engineer/Lead Engineer

Research Institute Company Limited • Hong Kong Island

On-site
HKD 600,000 - 900,000
Paid leave
Medical insurance
Contribution to MPF
Engineer, Software
Engineer, Software

ASTRI - Hong Kong Applied Science and Technology Research Institute • Hong Kong

On-site
HKD 300,000 - 600,000
Paid leave
Medical insurance coverage
Contribution to MPF