Principal Engineer/Associate Principal Engineer, 3D Package

ASTRI - Hong Kong Applied Science and Technology Research Institute; Hong Kong; On-site; HKD 900,000 - 1,200,000; Full time

Benefits offered by this job

Paid leave

Medical insurance

MPF contribution

Five‑day work week

Job summary

The Hong Kong Applied Science and Technology Research Institute (ASTRI) invites an experienced engineer to lead advanced package process development, including TGV and TSV applications, and to collaborate with product design and materials teams. The role emphasizes delivering robust process windows for prototypes and field support.

Candidates should have a Bachelor's degree or higher in engineering, 10+ years in packaging, and strong communication skills.

Qualifications

• Bachelor's degree or above in Mechanical Engineering, Materials Engineering, Chemical Engineering, or related disciplines.
• 10+ years experience in advanced packaging and process development; less experience will be considered as Associate Principal Engineer.
• Expertise in panel level and wafer level process development (e.g., chemical etching, electroplating for TGV and/or TSV applications) will be a big plus.
• Good communication and interpersonal skills, a good team player.
• Live the ASTRI values.

Responsibilities

• Responsible for advanced package process development, including etching, electroplating, thinning, 3D stacking, dicing, etc. for TGV (through‑glass‑via) and/or TSV (through‑silicon‑via) related applications.
• Work with product design and material development teams to develop optimal process window for engineering prototype build.
• Transfer technical solution to the customer and provide on‑site technical support.
• Perform ad hoc duties as assigned.

Skills

Advanced packaging

Process development

Wafer/panel level methods

Technical leadership

Education

Bachelor's degree or above in Mechanical Engineering, Materials Engineering, Chemical Engineering, or related disciplines

Job description

Hong Kong Applied Science and Technology Research Institute (ASTRI) is founded in 2000 by the Government of the Hong Kong Special Administrative Region. As Hong Kong’s largest government-funded research and development centre, ASTRI is a key force and super‑connector driving innovation and technology advancement in Hong Kong, the Greater Bay Area, and the global innovation ecosystem. This role is strengthened through its merger with Nano and Advanced Materials Institute (NAMI).

Committed to bringing high‑impact research from lab to market, ASTRI advances interdisciplinary, market‑driven R&D that delivers practical innovations for industry and meaningful benefits for society.

Its technological strengths and capabilities enable AI‑powered, cross‑disciplinary ICT and advanced materials solutions across Smart City, Financial Technologies, Digital Health and Life Sciences, New Industrialisation and Intelligent Manufacturing, Application‑Specific Integrated Circuits (ASIC) and Advanced Electronics, New Energy and Energy Storage, and Green and ESG Technologies.

Over the years, ASTRI has cultivated a strong pool of I&T talent and earned numerous international awards for its pioneering innovations and contributions to industry and the community. Following the merger with NAMI, ASTRI’s cumulative global patent portfolio has grown to over 1,500, with more than 2,200 technologies successfully transferred to industry.

With enhanced scale and capabilities, ASTRI is uniquely positioned to elevate Hong Kong’s innovation capacity, accelerate technology commercialisation, and drive societal and economic progress through world‑class applied research.

Job Responsibilities

• Responsible for advanced package process development, including etching, electroplating, thinning, 3D stacking, dicing, etc. for TGV (through‑glass‑via) and/or TSV (through‑silicon‑via) related applications.
• Work with product design and material development teams to develop optimal process window for engineering prototype build.
• Transfer technical solution to the customer and provide on‑site technical support.
• Perform ad hoc duties as assigned.

Job Requirements

• Bachelor's degree or above in Mechanical Engineering, Material Engineering, Chemical Engineering, or related disciplines.
• 10+ years experience in advanced packaging and process development; less experience will be considered as Associate Principal Engineer.
• Expertise in panel level and wafer level process development (e.g., chemical etching, electroplating for TGV and/or TSV applications) will be a big plus.
• Good communication and interpersonal skills, a good team player.
• Live the ASTRI values.

The appointment will be on renewable contract terms with a competitive salary and performance‑linked variable pay. Fringe benefits include paid leave, medical insurance coverage and contribution to MPF. The incumbent will normally work a five‑day week.

For interested parties, please submit your application with detailed CV within two weeks of the post date. Applicants are encouraged to submit their applications as soon as possible. The review of applications will continue until post is filled.

The resume should not include any sensitive personal information such as ID card no. or travel document number etc.

Position offer is subject to the applicant’s experience and academic qualification. Only short‑listed candidates will be notified. ASTRI reserves the right not to fill the position.

ASTRI is an Equal Opportunities Employer. Personal data provided by job applicants will be used exclusively for recruitment only. For details, please refer to ASTRI Privacy Policy Statement.