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STMicroelectronics in Edinburgh invites a Thermal-Mechanical Simulation Engineer to join the Optical Product Packaging & Design team. You will perform FEA, CFD, and multiphysics analyses to meet performance, manufacturability, and cost goals.
You will collaborate with package design engineers, optical engineers, and core team members across time zones, providing robust design recommendations and verification plans.
STMicroelectronics in Edinburgh invites a Thermal-Mechanical Simulation Engineer to join the Optical Product Packaging & Design team. You will perform FEA, CFD, and multiphysics analyses to meet performance, manufacturability, and cost goals.
You will collaborate with package design engineers, optical engineers, and core team members across time zones, providing robust design recommendations and verification plans.