Senior Process Engineer, Back-End-of-Line

Clarion Chase; Lincoln; On-site; GBP 65,000 - 90,000; Full time

Job summary

Clarion Chase partners with a leading-edge power semiconductor company to recruit a process engineer focusing on joining and interconnection technologies for power modules. The role involves bonding, soldering, sintering and materials assessment for high-reliability applications.

The successful candidate will lead experimental plans, root-cause analyses and DoE studies, and collaborate with suppliers to industrialise lab-scale methods into production in a global context.

Qualifications

• Degree in materials/science or related engineering discipline.
• Experience with experimental planning and process trials.
• Experience in root-cause analysis and failure investigation.
• Knowledge of materials characterisation and analytical techniques.

Responsibilities

• Develop, optimise and industrialise joining and interconnection processes (soldering, sintering, brazing, bonding).
• Research and select materials (solders, metals, ceramics, polymers, adhesives).
• Perform DoE and structured problem-solving to investigate issues.
• Characterise materials and process outputs using physical, chemical, mechanical, thermal and microstructural analyses.
• Define test methods and acceptance criteria per ISO/ASTM standards.
• Support transfer of lab processes to prototype/production environments.
• Collaborate with suppliers, universities and research organisations.

Skills

Materials Science

Data Analysis

Root-Cause Analysis

Bonding Technologies

Thermal Analysis

Materials Characterisation

High Power Packaging

DoE

Education

Materials Engineering Degree

Tools

Microscopy

Spectroscopy

Thermal Analysis

Job description

We are exclusively representing one of the leading-edge power semiconductor and electronics industry powerhouses by assisting them in expanding their process engineering capacity at their headquarters.

The business is an IDM of power devices that go into Rail, Industrial, Renewables, HVDC and Automotive applications globally.

They manufacture devices covering Silicon, Silicon Carbide, and Gallium Nitride mainly; these are the primary materials the position will be responsible for bonding/attaching to the power modules.

A summary of the responsibilities is below:

• Develop, optimise and industrialise joining and interconnection processes, including soldering, sintering, brazing, bonding and other advanced attachment technologies.
• Research, evaluate and select materials including solders, sinter materials, metals, ceramics, polymers, adhesives, silicone gels and other functional materials.
• Investigate material and process-related problems using structured root-cause analysis, failure analysis and Design of Experiments (DoE) techniques.
• Characterise materials and process outputs using appropriate physical, chemical, mechanical, thermal, electrical and microstructural analysis techniques.
• Develop methods for evaluating bond strength, interfacial integrity, material degradation and reliability.
• Define appropriate test methods and acceptance criteria in line with relevant ISO, ASTM and internal standards.
• Provide technical input into the design and development of next-generation power modules, considering thermal management, electrical isolation, mechanical stresses, reliability and manufacturability.
• Support the transfer of laboratory-developed processes into prototype and production environments.
• Work with external suppliers, material manufacturers, universities and research organisations to develop and qualify new materials and technologies.
• Prepare technical reports, specifications, presentations, risk assessments and process documentation, communicating complex technical information clearly to a range of audiences.

The required skillset is below:

• A degree in Materials Science, Materials Engineering, Metallurgy, Mechanical Engineering, Electrical/Electronic Engineering, Physics or a related scientific or engineering discipline.
• Strong experience in experimental planning, process trials, data analysis and interpretation.
• Experience of root-cause analysis, failure investigation and structured technical problem-solving.
• Good knowledge of materials characterisation and analytical techniques, including microscopy, spectroscopy, thermal analysis, mechanical testing or surface/interface analysis.
• A strong understanding of material interfaces, bonding mechanisms and the behaviour of dissimilar materials.
• IGBT, SiC or other high-power semiconductor module packaging id preferred.
• Die attach, substrate attach, power interconnects, encapsulation or electrical insulation systems.
• Pressure-assisted or pressure-less silver or copper sintering.
• High-temperature and high-reliability materials and processes.
• Thermo-mechanical behaviour, coefficient of thermal expansion (CTE), thermal conductivity, residual stress, warpage and fatigue in electronic packages.