Senior Power Module Design Engineer

Clarion Chase; Lincoln; On-site; GBP 50,000 - 65,000; Full time

Job summary

Clarion Chase is seeking an experienced Mechanical Engineer for its international HQ and manufacturing site, focused on power module packaging for IGBT, SiC and GaN devices. You will design, prototype and qualify high-density modules with strong thermal performance.

The role requires hands-on CAD work (Solid Edge/SolidWorks), GD&T proficiency and FE A experience, with a manufacturing mindset and APQP/FMEA awareness.

Qualifications

• A minimum BEng degree or equivalent in Mechanical Engineering or related discipline.
• Strong knowledge of mechanical design, mechanics and strength of materials.
• Good understanding of materials science, heat transfer and thermodynamics.
• Experience of mechanical design within a manufacturing environment, ideally involving electronics or semiconductor packaging.
• Strong hands-on experience using 3D CAD software, such as Solid Edge or SolidWorks.
• Experience producing detailed 2D engineering drawings for manufacturing and suppliers.
• Good understanding and practical application of GD&T.
• Experience using FEA, ideally with Ansys Mechanical.
• Knowledge of APQP and FMEA is an advantage.

Responsibilities

• Lead and contribute to the mechanical and packaging design of next-generation IGBT, SiC and GaN power modules.
• Develop innovative module architectures and packaging concepts that support high power density, fast switching and improved thermal performance.
• Create and develop 3D CAD models and 2D engineering drawings for new concepts and existing product improvements.
• Produce detailed engineering drawings suitable for manufacturing and procurement of components, jigs, and fixtures.
• Apply GD&T principles to ensure designs are suitable for manufacture and assembly.
• Design and develop jigs, fixtures and tooling for manufacturing processes, testing and qualification activities.
• Apply engineering principles covering mechanics, strength of materials, materials science, heat transfer, thermodynamics and fluid mechanics to power module design.
• Take designs from initial concept and CAD development through prototyping, testing, qualification and production implementation

Skills

Mechanical design

Strength of materials

Heat transfer

Thermodynamics

Materials science

APQP knowledge

FMEA knowledge

Education

BEng in Mechanical Engineering

Tools

Solid Edge

SolidWorks

FEA (Ansys Mechanical)

Job description

We are exclusively representing a high-profile, global leader in power semiconductors and electronics.

Their devices are commonly found in several applications within Rail, HVDC, Industrial, Renewables and Automotive applications.

We are hiring for their international headquarters, which also incorporates one of their manufacturing sites, where they seek an experienced Mechanical Engineer with experience designing the physical power module packaging.

A summary of the required experience is below:

• Lead and contribute to the mechanical and packaging design of next-generation IGBT, SiC and GaN power modules.
• Develop innovative module architectures and packaging concepts that support high power density, fast switching and improved thermal performance.
• Create and develop 3D CAD models and 2D engineering drawings for new concepts and existing product improvements.
• Produce detailed engineering drawings suitable for manufacturing and procurement of components, jigs, and fixtures.
• Apply GD&T principles to ensure designs are suitable for manufacture and assembly.
• Design and develop jigs, fixtures and tooling for manufacturing processes, testing and qualification activities.
• Apply engineering principles covering mechanics, strength of materials, materials science, heat transfer, thermodynamics and fluid mechanics to power module design.
• Take designs from initial concept and CAD development through prototyping, testing, qualification and production implementation

A summary of the required experience is below:

• A minimum BEng degree or equivalent in Mechanical Engineering or a related discipline such as Mechatronics, Electrical/Electronic Engineering or Physics
• Strong knowledge of mechanical design, mechanics and strength of materials.
• Good understanding of materials science, heat transfer and thermodynamics.
• Experience of mechanical design within a manufacturing environment, ideally involving electronics or semiconductor packaging.
• Strong hands-on experience using 3D CAD software, such as Solid Edge or SolidWorks.
• Experience producing detailed 2D engineering drawings for manufacturing and suppliers.
• Good understanding and practical application of GD&T.
• Experience using FEA, ideally with Ansys Mechanical.
• Knowledge of APQP and FMEA is an advantage.