Senior Packaging Process Engineer

TN United Kingdom; Newport; On-site; GBP 45,000 - 75,000; Full time

Job summary

An established industry player is seeking a Senior Packaging Process Engineer to spearhead the development of groundbreaking semiconductor packaging technologies. This exciting role involves leading a team dedicated to innovating microelectronic devices, with a focus on assembly, wire-bonding, and die bonding. The successful candidate will leverage their extensive experience in semiconductor packaging to drive prototype development and advance the integration of new technologies. Join a forward-thinking company where your expertise will contribute to shaping the future of semiconductor solutions in a dynamic R&D environment.

Qualifications

• Extensive experience in semiconductor packaging and assembly.
• Degree in relevant fields such as Physics or Engineering.

Responsibilities

• Lead a team to develop innovative semiconductor packaging technologies.
• Focus on assembly, wire-bonding, and die bonding for microelectronic devices.

Skills

Semiconductor packaging and assembly

Knowledge of semiconductor devices

Strong communication skills

Leadership skills

Education

Degree in Physics

Degree in Electronics

Degree in Engineering

Job description

Senior Packaging Process Engineer, Newport

This role is based in Newport and involves working within a challenging R&D environment focused on developing disruptive semiconductor packaging and integration technologies.

Client:

IC Resources

Location:

Newport, United Kingdom

Job Category:

-

EU work permit required:

Yes

Job Reference:

2a04db758363

Job Views:

11

Posted:

29.04.2025

Expiry Date:

13.06.2025

Job Description:

Our Newport-based client is seeking a Senior Packaging Process Engineer to lead efforts in exploring and developing innovative semiconductor packaging and integration technologies. The role involves leading a team to develop new microelectronic devices, focusing on assembly, wire-bonding, and die bonding, with prototype development as a key component.

Required skills include:

• Extensive experience in semiconductor packaging and assembly
• Knowledge of semiconductor devices
• Strong communication and leadership skills
• Degree in Physics, Electronics, Engineering, or equivalent

For further details, please contact Rachel Anderson.