Senior Packaging Process Engineer

Catapult; Newport; On-site; GBP 50,000 - 90,000; Full time

Job summary

An innovative firm is seeking a Senior Packaging Process Engineer to drive the development of advanced semiconductor packaging solutions. This role involves leading multidisciplinary teams in a dynamic R&D environment, focusing on cutting-edge technologies in 3D and 2.5D integration. You will tackle complex assembly challenges, mentor junior engineers, and collaborate with various teams to ensure alignment with program goals. If you are passionate about advancing semiconductor technology and enjoy working in a collaborative environment, this opportunity is perfect for you.

Qualifications

• Expert knowledge in microelectronics assembly and validation.
• Broad knowledge of semiconductor package engineering and technology.

Responsibilities

• Lead development of advanced packaging assembly processes.
• Define and validate interconnect schemes for performance targets.

Skills

3D/2.5D integration

high-speed interconnects

advanced semiconductor packaging

microelectronics assembly

bonding materials

design-for-manufacturing (DFM)

statistical process control

Education

Bachelor's degree in Engineering or related field

Master's degree in Engineering or related field

Tools

die bonders

sinter presses

wire bonders

plasma cleaners

Job description

CSA Catapult requires a Senior Packaging Process Engineer to work in a challenging R&D environment to explore and develop disruptive semiconductor packaging and integration technologies with a strong background in 3D and 2.5D integration, high-speed interconnects, and advanced semiconductor packaging. This role is pivotal in driving the development of cutting-edge packaging solutions for next-generation systems in AI, co-packaged RF and photonics systems.

The Senior Packaging Process Engineer shall be a subject matter expert/ specialist leading a projectteam of multidisciplinary engineers to deliver complex integration projects, enabling heterogeneous system-in-package (SiP) platforms and performance-optimized device architectures.

The Senior Engineer is expected to have expert knowledge in microelectronics assembly and validation, and broad knowledge of semiconductor package engineering, science and technology with prior experience. They will be applying their knowledge to solve the semiconductor assembly and bonding challenges in advanced packaging of CS products using a wide range of bonding materials. They will support planning projects, bid preparation, technical proposals and quotations, working closely with the bid team and commercial team.

Key responsibilities include:

• Lead the development of advanced packaging assembly processes, focusing on 3D/2.5D integration, high-density interposers, and high-speed interconnect solutions (e.g., micro-bumps, hybrid bonding, through-silicon vias)
• Design and validate high-speed interconnect solutions as part of heterogeneous integration and system-in-package (SiP) platforms
• Define and validate interconnect schemes (fine-pitch flip chip, wafer-level packaging, hybrid bonding) to meet electrical, thermal, and mechanical performance targets
• Develop robust assembly process flows, including die attach, underfill, bonding, and encapsulation for 3D stacked and interposer-based packages
• Lead design-for-manufacturing (DFM) activities in collaboration with internal and external design and product development teams
• Drive technical DOEs, reliability testing, failure analysis, and statistical process control for advanced packaging
• Interface with technology partners, equipment vendors, and customers to evaluate and implement state-of-the-art materials and tools (e.g., low-loss dielectrics, ultra-fine-pitch interconnects)
• Lead lab-based activities including equipment setup, process characterization, prototyping, and DOEs using tools such as die bonders, sinter presses, wire bonders, and plasma cleaners
• Lead project teams, contribute to bid proposals, technical plans, and funding applications
• Act as a technical authority across multiple packaging projects, mentoring junior engineers and collaborating with cross-functional teams
• Support the preparation of technical documentation, including work instructions, process flow diagrams, and qualification reports
• Interface with commercial, R&D, and customer teams to ensure alignment of assembly processes with program goals
• Contribute to the development of scale-up plans and futureproofing strategies for process industrialization and facility readiness
• Contribute to the strategic roadmap for CSA Catapult’s advanced packaging capability
• Present results and work to wide audiences to enhance the reputation of the Catapult