Senior Opto-Mechanical Packaging Engineer - Fibre-to-Chip

Entangled Future; United Kingdom; Remote; GBP 70,000 - 95,000; Full time

Job summary

PsiQuantum in the UK, based at Daresbury, seeks a Senior Optical Packaging Engineer to develop and implement high-performance opto-electronic packaging workflows for chip-based photonic integrated circuits.

The role focuses on scalable fibre-to-chip packaging, alignment schemes, and collaboration with internal teams and external vendors to transfer designs and scale production in a UK facility.

Qualifications

• Master’s degree or higher in Optical Engineering or Physics.
• Minimum 3+ years in PIC packaging design and qualification.
• 5+ years of experience with optical fibers and measurements.
• 3+ years FAU/optical connector to chip attachment.
• Experience with optical data analysis.

Responsibilities

• Develop an optical package and fibre-to-chip alignment scheme with high alignment accuracy and scalable assembly.
• Develop packaging prototypes & scalable fibre-to-chip packaging flows and processes.
• Review packaging design BOMs and coordinate with supply chain for parts.
• Collaborate with internal packaging team and external vendors to transfer and scale packaging designs.
• Source materials with external vendors and provide feedback on evolving requirements.
• Work with external partners to develop advanced opto-electronic packaging solutions.

Skills

PIC packaging design

Optical alignment

Optical data analysis

Optical fiber handling

FAU / optical connector to chip

Education

Master's degree or above in Optical Engineering/Physics

Job description

PsiQuantum in the UK, based at Daresbury, seeks a Senior Optical Packaging Engineer to develop and implement high-performance opto-electronic packaging workflows for chip-based photonic integrated circuits.

The role focuses on scalable fibre-to-chip packaging, alignment schemes, and collaboration with internal teams and external vendors to transfer designs and scale production in a UK facility.