Senior Optical Packaging & Assembly Engineer

Entangled Future; United Kingdom; Remote; GBP 70,000 - 95,000; Full time

Job summary

PsiQuantum in the UK, based at Daresbury, seeks a Senior Optical Packaging Engineer to develop and implement high-performance opto-electronic packaging workflows for chip-based photonic integrated circuits.

The role focuses on scalable fibre-to-chip packaging, alignment schemes, and collaboration with internal teams and external vendors to transfer designs and scale production in a UK facility.

Qualifications

• Master’s degree or higher in Optical Engineering or Physics.
• Minimum 3+ years in PIC packaging design and qualification.
• 5+ years of experience with optical fibers and measurements.
• 3+ years FAU/optical connector to chip attachment.
• Experience with optical data analysis.

Responsibilities

• Develop an optical package and fibre-to-chip alignment scheme with high alignment accuracy and scalable assembly.
• Develop packaging prototypes & scalable fibre-to-chip packaging flows and processes.
• Review packaging design BOMs and coordinate with supply chain for parts.
• Collaborate with internal packaging team and external vendors to transfer and scale packaging designs.
• Source materials with external vendors and provide feedback on evolving requirements.
• Work with external partners to develop advanced opto-electronic packaging solutions.

Skills

PIC packaging design

Optical alignment

Optical data analysis

Optical fiber handling

FAU / optical connector to chip

Education

Master's degree or above in Optical Engineering/Physics

Job description

Senior Optical Packaging & Assembly Engineer at PsiQuantum, Daresbury, England. A senior-level full time position in the 4550 - Experimental Quantum Systems team, listed under hardware engineering.

Come join us.

Job Summary

The Senior Optical Packaging Engineer is responsible for developing & implementing high-performance, robust & scalable opto-electronic packaging workflows for a variety of chip-based photonic integrated circuits. This work will be carried out in PsiQuantum’s UK R&D facility located in Daresbury Lab.

Note: PsiQuantum will only reach out to you using an official PsiQuantum email address and will never ask you for bank account information as part of the interview process. Please report any suspicious activity to [e-mail] .

Responsibilities

• Develop an optical package and fibre-to-chip alignment scheme that allows for high alignment accuracy and scalable assembly.
• Help develop packaging prototypes & scalable fibre-to-chip packaging flows and processes.
• Review packaging design BOMs, work with supply chain on procuring parts needed for assembly.
• Work with our internal packaging team and external vendors on transferring & scaling packaging designs and processes based on successful prototypes.
• Work with external vendors and suppliers to source required materials and provide feedback on evolving requirements.
• Working with external partners to develop advanced opto-electronic packaging solutions.

Requirements

• Master’s Degree or above in Optical Engineering, Physics or equivalent.
• 3+ years of experience working on PIC packaging design & qualification.
• 5+ years of experience working with optical fibers, optical measurements.
• 3+ years of experience working on FAU / optical connector to chip attachment.
• Experience with optical data analysis.