Mechanical Engineer, Microelectronics for Harsh Environments

Redline Group Ltd; Milton Keynes; Hybrid; GBP 42,000 - 64,000; Full time

Job summary

Redline Group Ltd. seeks a Mechanical Engineer specializing in microelectronic products, based in Milton Keynes, with hybrid working and a 9-day working fortnight.

You will develop microelectronic products for harsh environments and collaborate across design, reliability, manufacturing, process, test and quality to ensure proper packaging, materials and assembly methods. Ideal candidates will have hands-on thermal and stress analysis experience, SOLIDWORKS proficiency, and knowledge of heat

Qualifications

• Experience performing thermal and stress analysis and interpreting results to inform engineering decisions.
• Proficiency in SOLIDWORKS for 3D modelling and engineering drawings, and SOLIDWORKS Simulation for thermal and stress analysis, with an understanding of tolerances and assembly requirements.
• Good understanding of heat transfer, thermal expansion, material properties and their effects on product performance.
• Experience with microelectronics, electronic packaging, hybrid assemblies, ceramic substrates, die attach or wire bonding.
• Experience with finite element analysis for thermal stress, vibration or other mechanical loading.
• Experience developing products for high-temperature or harsh-environment applications.

Responsibilities

• Develop microelectronic products used in harsh environments.
• Collaborate across electronic design, reliability, manufacturing, process, test and quality to ensure packaging, materials, assembly methods and processes meet customer requirements.

Skills

Thermal analysis

FEM analysis

Heat transfer

Microelectronics

Packaging

Wire bonding

Harsh environments

Tools

SOLIDWORKS

SOLIDWORKS Simulation

Job description

Redline Group Ltd. seeks a Mechanical Engineer specializing in microelectronic products, based in Milton Keynes, with hybrid working and a 9-day working fortnight.

You will develop microelectronic products for harsh environments and collaborate across design, reliability, manufacturing, process, test and quality to ensure proper packaging, materials and assembly methods. Ideal candidates will have hands-on thermal and stress analysis experience, SOLIDWORKS proficiency, and knowledge of heat