Hybrid Mechanical Engineer - Microelectronic Packaging & Thermal

Redline Group Ltd; Gorleston-on-Sea; Hybrid; GBP 42,000 - 60,000; Full time

Job summary

Redline Group Ltd is seeking a Mechanical Engineer specialising in Microelectronic Products, based in Milton Keynes, Buckinghamshire, with hybrid working and a 9-day fortnight. You will develop microelectronic products for harsh environments and collaborate across electronic design, reliability, manufacturing, process, test and quality to ensure robust packaging and assembly methods.

Ideal candidates will have proven experience in thermal and stress analysis, proficiency in SOLIDWORKS and

Qualifications

• Thermal and stress analysis experience with interpretation of results.
• Proficiency in SOLIDWORKS for 3D modelling and SOLIDWORKS Simulation for thermal and stress analysis.
• Understanding of heat transfer, thermal expansion and material properties.
• Experience with microelectronics, electronic packaging, hybrid assemblies, ceramic substrates, die attach or wire bonding.
• Experience with finite element analysis for thermal stress, vibration or other loading.
• Experience developing products for high-temperature or harsh environments.

Responsibilities

• Develop microelectronic products for harsh environments.
• Collaborate across electronic design, reliability, manufacturing, process, test and quality to ensure robust packaging and assembly methods.

Tools

SOLIDWORKS

SOLIDWORKS Simulation

Job description

Redline Group Ltd is seeking a Mechanical Engineer specialising in Microelectronic Products, based in Milton Keynes, Buckinghamshire, with hybrid working and a 9-day fortnight. You will develop microelectronic products for harsh environments and collaborate across electronic design, reliability, manufacturing, process, test and quality to ensure robust packaging and assembly methods.

Ideal candidates will have proven experience in thermal and stress analysis, proficiency in SOLIDWORKS and