Mechanical Engineer - Microelectronics (Hybrid, 9‑Day Fortnight)

Redline Group; Milton Keynes; Hybrid; GBP 40,000 - 52,000; Full time

Job summary

Redline Group in Milton Keynes is seeking a Mechanical Engineer specialized in microelectronic products to join a hybrid team focusing on harsh-environment applications. You will work across design, reliability, manufacturing, process, test and quality to align packaging, materials and assembly with customer requirements.

Ideal candidates will have hands-on thermal and stress analysis skills, SOLIDWORKS proficiency, and experience with microelectronics packaging and high-temperature

Qualifications

• Practical experience performing thermal and stress analysis and interpreting results.
• Proficiency in SOLIDWORKS for 3D modelling and engineering drawings.
• SOLIDWORKS Simulation experience for thermal and stress analysis.
• Strong understanding of heat transfer and material properties.
• Experience with microelectronics packaging and harsh-environment products.
• Experience with finite element analysis for thermal or mechanical loading.

Responsibilities

• Develop microelectronic products for harsh environments.
• Collaborate across electronic design, reliability, manufacturing, process, test and quality teams to ensure packaging, materials, assembly methods and manufacturing processes meet customer requirements.
• Join a well R&D & Production team that provides superb on-the-job training and opportunities for career progression.

Skills

Thermal analysis

Stress analysis

Heat transfer

Finite element analysis

Die attach

Wire bonding

Harsh-environment design

Dimensional tolerances

Microelectronics packaging

Tools

SOLIDWORKS

SOLIDWORKS Simulation

Job description

Redline Group in Milton Keynes is seeking a Mechanical Engineer specialized in microelectronic products to join a hybrid team focusing on harsh-environment applications. You will work across design, reliability, manufacturing, process, test and quality to align packaging, materials and assembly with customer requirements.

Ideal candidates will have hands-on thermal and stress analysis skills, SOLIDWORKS proficiency, and experience with microelectronics packaging and high-temperature