Electro-Mechanical Design Engineer based Colchester, Essex

Mechanical Engineering; Colchester; Hybrid; GBP 42,000 - 62,000; Full time

Benefits offered by this job

Relocation allowance

Job summary

Unknown company in Colchester, Essex, is seeking an electro-mechanical design engineer to develop thermal and mechanical solutions for electronic products intended for harsh environments. The role requires graduate-level education and experience with rugged, reliable embedded systems.

The successful candidate will design for compactness and cost, demonstrate ability to work independently, and contribute to projects in short timescales.

Qualifications

• Design thermal and mechanical solutions for electronic products in harsh environments.
• Experience with rugged environments and high reliability embedded systems.
• Ability to work with little supervision and deliver in short timescales.
• Familiarity with SolidWorks for mechanical design and CF Design for thermal analysis.

Responsibilities

• Design cost-effective, compact solutions with suitable thermal transfer.
• Develop rugged electromechanical designs for defence/industrial markets.
• Collaborate with cross-functional teams to meet tight deadlines.

Skills

Thermal design

Mechanical design

Harsh environment

Self-starting

Project planning

Education

Graduate degree in engineering

Tools

SolidWorks

CF Design

VME bus

CompactPCI bus

Job description

Electro-Mechanical Design Engineer based Colchester, Essex

Electro-Mechanical Design Engineer (Harsh Environment Products)- experience of designing thermal and mechanical solutions for electronic products in harsh environments - based Colchester, Essex - competitive salary and excellent benefits package to include relocation allowance.

We are looking for an established Mechanical Design Engineer who is educated to graduate level and who has experience of designing thermal and mechanical solutions for electronic products in harsh environments to work for a leading developer and manufacturer of high end embedded computer products for critical applications in the defence, communications, transportation, aerospace and industrial markets.

Candidates will need to demonstrate an ability to design cost-effective and compact solutions which have thermal transfer characteristics and must be independent, self-starters able to plan and carry out work with little supervision and deliver effective results in short timescales.

Experience with bus-based modular boards, products dissipating 60W or more and BGA packaged electronic components is preferable but not essential as is familiarity with VME or CompactPCI bus systems.

Practical experience of the thermal and mechanical issues involved in designing for rugged environments such as airborne or ground vehicle mounted equipment would be a significant advantage as would familiarity with Solidworks for mechanical design and CF Design for thermal analysis.