Graduate MEMS Packaging Engineer

JR United Kingdom; Hounslow; On-site; GBP 28,000 - 35,000; Full time

Job summary

A leading technology startup in London seeks a Graduate MEMS Packaging Engineer. This position offers new graduates an opportunity to engage in hands-on work within the Operations team, focusing on MEMS and antenna packaging. Candidates should have a relevant degree and a proactive approach to problem-solving.

Qualifications

• Recent graduate with a degree in Electronics, Mechanical Engineering or related field.
• Strong grasp of fundamental engineering principles.
• Exposure to semiconductor packaging or MEMS technologies is beneficial.

Responsibilities

• Support development of MEMS and antenna packaging processes.
• Conduct lab-based tests and participate in reliability test execution.

Skills

Engineering principles

Problem solving

Semiconductor packaging

Education

Bachelor’s degree in Electronics Engineering

Bachelor’s degree in Mechanical Engineering

Bachelor’s degree in Materials Science

Job description

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Graduate MEMS Packaging Engineer, south west london

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Client:

IC Resources

Location:

south west london, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

06.06.2025

Expiry Date:

21.07.2025

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Job Description:

Our Edinburgh based client is currently searching for a Graduate MEMS Packaging Engineer to join the Operations team. This is an excellent opportunity for a recent graduate with a degree in Electronics, Mechanical Engineering, or a related field to gain hands-on experience in a fast-paced, high-impact technology startup. The role will involve supporting the development of MEMS and antenna subassembly packaging processes and materials. Conducting lab based tests and participating in the design and execution of reliability tests will be an important part of the role.

Required skills for the Graduate MEMS Packaging Engineer will include:

• Strong grasp of fundamental engineering principals (DOE, basic statistics)
• Problem solving mind-set
• Exposure to semiconductor packaging, MEMS, or RF technologies beneficial
• Bachelor’s degree in Electronics Engineering, Mechanical Engineering, Materials Science, or a related discipline.

Please contact Rachel Anderson for further details.