Graduate MEMS Packaging Engineer

JR United Kingdom; Nottingham; On-site; GBP 25,000 - 35,000; Full time

Job summary

A leading technology startup is looking for a Graduate MEMS Packaging Engineer in Nottingham. This role offers a recent graduate the opportunity to gain hands-on experience in a fast-paced environment, focusing on MEMS and antenna subassembly packaging. The ideal candidate will have a relevant engineering degree and strong problem-solving skills.

Qualifications

• Recent graduate with degree in Electronics, Mechanical Engineering, or related field.
• Familiarity with semiconductor packaging, MEMS, or RF technologies is beneficial.

Responsibilities

• Supporting the development of MEMS and antenna subassembly packaging processes.
• Conducting lab-based tests and executing reliability tests.

Skills

Strong grasp of fundamental engineering principals

Problem solving mind-set

Exposure to semiconductor packaging

Exposure to MEMS technologies

Exposure to RF technologies

Education

Bachelor’s degree in Electronics Engineering

Bachelor’s degree in Mechanical Engineering

Bachelor’s degree in Materials Science

related discipline

Job description

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Graduate MEMS Packaging Engineer, nottingham

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Client:

IC Resources

Location:

nottingham, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

06.06.2025

Expiry Date:

21.07.2025

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Job Description:

Our Edinburgh based client is currently searching for a Graduate MEMS Packaging Engineer to join the Operations team. This is an excellent opportunity for a recent graduate with a degree in Electronics, Mechanical Engineering, or a related field to gain hands-on experience in a fast-paced, high-impact technology startup. The role will involve supporting the development of MEMS and antenna subassembly packaging processes and materials. Conducting lab based tests and participating in the design and execution of reliability tests will be an important part of the role.

Required skills for the Graduate MEMS Packaging Engineer will include:

• Strong grasp of fundamental engineering principals (DOE, basic statistics)
• Problem solving mind-set
• Exposure to semiconductor packaging, MEMS, or RF technologies beneficial
• Bachelor’s degree in Electronics Engineering, Mechanical Engineering, Materials Science, or a related discipline.

Please contact Rachel Anderson for further details.