Graduate MEMS Packaging Engineer

JR United Kingdom; Chesterfield; On-site; GBP 28,000 - 35,000; Full time

Job summary

A leading technology startup is seeking a Graduate MEMS Packaging Engineer in Chesterfield, offering recent graduates an excellent opportunity to gain practical experience. This role focuses on packaging processes and materials for MEMS, along with conducting critical lab tests, making it ideal for graduates who are eager to develop their engineering skills.

Qualifications

• Strong grasp of fundamental engineering principles essential.
• Exposure to MEMS, semiconductor packaging, or RF technologies beneficial.
• Recent graduate preferably with a related degree.

Responsibilities

• Support development of MEMS and antenna subassembly packaging processes.
• Conduct lab-based tests and reliability tests.

Skills

Problem solving

Fundamental engineering principles

Basic statistics

Education

Bachelor’s degree in Electronics Engineering

Bachelor’s degree in Mechanical Engineering

Bachelor’s degree in Materials Science

Tools

Semiconductor packaging

MEMS technologies

RF technologies

Job description

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Graduate MEMS Packaging Engineer, chesterfield

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Client:

IC Resources

Location:

chesterfield, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

06.06.2025

Expiry Date:

21.07.2025

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Job Description:

Our Edinburgh based client is currently searching for a Graduate MEMS Packaging Engineer to join the Operations team. This is an excellent opportunity for a recent graduate with a degree in Electronics, Mechanical Engineering, or a related field to gain hands-on experience in a fast-paced, high-impact technology startup. The role will involve supporting the development of MEMS and antenna subassembly packaging processes and materials. Conducting lab based tests and participating in the design and execution of reliability tests will be an important part of the role.

Required skills for the Graduate MEMS Packaging Engineer will include:

• Strong grasp of fundamental engineering principals (DOE, basic statistics)
• Problem solving mind-set
• Exposure to semiconductor packaging, MEMS, or RF technologies beneficial
• Bachelor’s degree in Electronics Engineering, Mechanical Engineering, Materials Science, or a related discipline.

Please contact Rachel Anderson for further details.