Graduate MEMS Packaging Engineer

JR United Kingdom; Doncaster; On-site; GBP 25,000 - 35,000; Full time

Job summary

A leading technology startup based in Edinburgh is seeking a Graduate MEMS Packaging Engineer to enhance their Operations team. This role offers hands-on experience in MEMS packaging and testing as part of innovative technology development. Recent graduates with Engineering degrees are encouraged to apply.

Qualifications

• Bachelor’s degree in Electronics, Mechanical Engineering, or related field is required.
• Strong grasp of fundamental engineering principles (DOE, basic statistics).
• Exposure to semiconductor packaging, MEMS, or RF technologies is beneficial.

Responsibilities

• Support development of MEMS and antenna subassembly packaging processes.
• Conduct lab-based tests and participate in reliability test design and execution.

Skills

Problem solving

Fundamental engineering principles

Basic statistics

Education

Bachelor’s degree in Electronics Engineering

Bachelor’s degree in Mechanical Engineering

Bachelor’s degree in Materials Science

Job description

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Client:

IC Resources

Location:

doncaster, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

06.06.2025

Expiry Date:

21.07.2025

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Job Description:

Our Edinburgh based client is currently searching for a Graduate MEMS Packaging Engineer to join the Operations team. This is an excellent opportunity for a recent graduate with a degree in Electronics, Mechanical Engineering, or a related field to gain hands-on experience in a fast-paced, high-impact technology startup. The role will involve supporting the development of MEMS and antenna subassembly packaging processes and materials. Conducting lab based tests and participating in the design and execution of reliability tests will be an important part of the role.

Required skills for the Graduate MEMS Packaging Engineer will include:

• Strong grasp of fundamental engineering principals (DOE, basic statistics)
• Problem solving mind-set
• Exposure to semiconductor packaging, MEMS, or RF technologies beneficial
• Bachelor’s degree in Electronics Engineering, Mechanical Engineering, Materials Science, or a related discipline.

Please contact Rachel Anderson for further details.