Graduate MEMS Packaging Engineer

JR United Kingdom; Milton Keynes; On-site; GBP 25,000 - 35,000; Full time

Job summary

A technology startup in Edinburgh seeks a Graduate MEMS Packaging Engineer to support packaging processes in an exciting and dynamic environment. This role is perfect for recent graduates eager to apply their knowledge and make an impact in the field of MEMS technology.

Qualifications

• Recent graduate with a degree in Electronics, Mechanical Engineering, or a related field.
• Hands-on experience in a fast-paced, high-impact technology startup.
• Familiarity with MEMS and antenna subassembly packaging processes.

Responsibilities

• Support development of MEMS and antenna subassembly packaging processes.
• Conduct lab-based tests and reliability tests.

Skills

Problem solving mind-set

Strong grasp of fundamental engineering principals

Exposure to semiconductor packaging

Exposure to MEMS technologies

Exposure to RF technologies

Education

Bachelor’s degree in Electronics Engineering

Bachelor’s degree in Mechanical Engineering

Bachelor’s degree in Materials Science

Job description

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Client:

IC Resources

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Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

06.06.2025

Expiry Date:

21.07.2025

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Job Description:

Our Edinburgh based client is currently searching for a Graduate MEMS Packaging Engineer to join the Operations team. This is an excellent opportunity for a recent graduate with a degree in Electronics, Mechanical Engineering, or a related field to gain hands-on experience in a fast-paced, high-impact technology startup. The role will involve supporting the development of MEMS and antenna subassembly packaging processes and materials. Conducting lab based tests and participating in the design and execution of reliability tests will be an important part of the role.

Required skills for the Graduate MEMS Packaging Engineer will include:

• Strong grasp of fundamental engineering principals (DOE, basic statistics)
• Problem solving mind-set
• Exposure to semiconductor packaging, MEMS, or RF technologies beneficial
• Bachelor’s degree in Electronics Engineering, Mechanical Engineering, Materials Science, or a related discipline.

Please contact Rachel Anderson for further details.