Graduate MEMS Packaging Engineer

JR United Kingdom; London; On-site; GBP 30,000 - 40,000; Full time

Job summary

A leading technology startup in London is seeking a Graduate MEMS Packaging Engineer to join their dynamic Operations team. This role is ideal for recent graduates looking to gain hands-on experience in MEMS packaging and reliability testing. The successful candidate will contribute to innovative projects in a fast-paced environment, enhancing their engineering skills and knowledge in semiconductor and RF technologies.

Qualifications

• Recent graduate with a degree in Electronics, Mechanical Engineering, or a related field.
• Hands-on experience in engineering processes and materials preferred.

Responsibilities

• Support the development of MEMS and antenna subassembly packaging processes.
• Conduct lab-based tests and participate in reliability tests.

Skills

Strong grasp of fundamental engineering principles (DOE, basic statistics)

Problem solving mind-set

Exposure to semiconductor packaging

Exposure to MEMS technologies

Exposure to RF technologies

Education

Bachelor’s degree in Electronics Engineering

Bachelor’s degree in Mechanical Engineering

Bachelor’s degree in Materials Science

Job description

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Graduate MEMS Packaging Engineer, west london

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Client:

IC Resources

Location:

west london, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

06.06.2025

Expiry Date:

21.07.2025

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Job Description:

Our Edinburgh based client is currently searching for a Graduate MEMS Packaging Engineer to join the Operations team. This is an excellent opportunity for a recent graduate with a degree in Electronics, Mechanical Engineering, or a related field to gain hands-on experience in a fast-paced, high-impact technology startup. The role will involve supporting the development of MEMS and antenna subassembly packaging processes and materials. Conducting lab based tests and participating in the design and execution of reliability tests will be an important part of the role.

Required skills for the Graduate MEMS Packaging Engineer will include:

• Strong grasp of fundamental engineering principals (DOE, basic statistics)
• Problem solving mind-set
• Exposure to semiconductor packaging, MEMS, or RF technologies beneficial
• Bachelor’s degree in Electronics Engineering, Mechanical Engineering, Materials Science, or a related discipline.

Please contact Rachel Anderson for further details.