Graduate MEMS Packaging Engineer

JR United Kingdom; Hemel Hempstead; On-site; GBP 28,000 - 35,000; Full time

Job summary

A UK-based technology startup seeks a Graduate MEMS Packaging Engineer to join their Operations team. This role offers an excellent opportunity to gain hands-on experience in MEMS technology, focusing on packaging processes and materials. Ideal candidates should have a degree in Electronics, Mechanical Engineering, or Materials Science, along with a solid understanding of engineering principles and problem-solving skills.

Qualifications

• Recent graduate with a degree in a related field.
• Strong grasp of DOE and basic statistics.
• Exposure to MEMS packaging beneficial.

Responsibilities

• Support development of MEMS and antenna packaging processes.
• Conduct lab-based tests and reliability tests.
• Participate in design and execution of projects.

Skills

Fundamental engineering principles

Problem solving

Semiconductor packaging

MEMS technologies

RF technologies

Education

Bachelor’s degree in Electronics Engineering

Bachelor’s degree in Mechanical Engineering

Bachelor’s degree in Materials Science

Job description

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Client:

IC Resources

Location:

hemel hempstead, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

06.06.2025

Expiry Date:

21.07.2025

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Job Description:

Our Edinburgh based client is currently searching for a Graduate MEMS Packaging Engineer to join the Operations team. This is an excellent opportunity for a recent graduate with a degree in Electronics, Mechanical Engineering, or a related field to gain hands-on experience in a fast-paced, high-impact technology startup. The role will involve supporting the development of MEMS and antenna subassembly packaging processes and materials. Conducting lab based tests and participating in the design and execution of reliability tests will be an important part of the role.

Required skills for the Graduate MEMS Packaging Engineer will include:

• Strong grasp of fundamental engineering principals (DOE, basic statistics)
• Problem solving mind-set
• Exposure to semiconductor packaging, MEMS, or RF technologies beneficial
• Bachelor’s degree in Electronics Engineering, Mechanical Engineering, Materials Science, or a related discipline.

Please contact Rachel Anderson for further details.