Graduate MEMS Packaging Engineer

JR United Kingdom; Chelmsford; On-site; GBP 25,000 - 35,000; Full time

Job summary

A leading technology startup in the UK is seeking a Graduate MEMS Packaging Engineer to join their operations team. This role offers recent graduates the chance to gain hands-on experience in MEMS packaging processes and materials within a dynamic environment. Candidates should have relevant engineering degrees and a proactive problem-solving attitude.

Qualifications

• Degree in Electronics, Mechanical Engineering, or related field required.
• Strong grasp of engineering principles and fundamental statistics.
• Experience in semiconductor packaging or MEMS is beneficial.

Responsibilities

• Support the development of MEMS and antenna subassembly packaging processes.
• Conduct lab-based tests and participate in reliability tests.

Skills

Problem solving mind-set

Fundamental engineering principles

Exposure to semiconductor packaging

Education

Bachelor’s degree in Electronics Engineering

Bachelor’s degree in Mechanical Engineering

Bachelor’s degree in Materials Science

Job description

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Graduate MEMS Packaging Engineer, chelmsford

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Client:

IC Resources

Location:

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

06.06.2025

Expiry Date:

21.07.2025

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Job Description:

Our Edinburgh based client is currently searching for a Graduate MEMS Packaging Engineer to join the Operations team. This is an excellent opportunity for a recent graduate with a degree in Electronics, Mechanical Engineering, or a related field to gain hands-on experience in a fast-paced, high-impact technology startup. The role will involve supporting the development of MEMS and antenna subassembly packaging processes and materials. Conducting lab based tests and participating in the design and execution of reliability tests will be an important part of the role.

Required skills for the Graduate MEMS Packaging Engineer will include:

• Strong grasp of fundamental engineering principals (DOE, basic statistics)
• Problem solving mind-set
• Exposure to semiconductor packaging, MEMS, or RF technologies beneficial
• Bachelor’s degree in Electronics Engineering, Mechanical Engineering, Materials Science, or a related discipline.

Please contact Rachel Anderson for further details.